Used AMAT / APPLIED MATERIALS Reflexion 3600 #293604683 for sale

ID: 293604683
Wafer Size: 12"
Vintage: 2003
CMP System, 12" 2003 vintage.
AMAT / APPLIED MATERIALS Reflexion 3600 is an advanced wafer grinding, lapping and polishing equipment designed to be reliable and cost-effective. It is a multi-functional system, able to perform various polishing processes depending on the application, and can be configured for single- or double-sided machining. AMAT Reflexion 3600 integrates several key components, including a belt drive unit, a worktable drive, a polishing head unit, and a chucking machine. The belt drive tool provides a high degree of precision and accuracy, with a positioning range from 0.5 mm to 9999.99 mm. APPLIED MATERIALS Reflexion 3600 is capable of achieving extremely precise cuts and repeats with a highest accuracy of 0.02 μm. The intuitive user controls of Reflexion 3600 feature an easy-to-use, menu-driven interface, as well as convenient touchscreen operation and display. The asset is capable of processing a variety of substrates, including glass, ceramic, quartz, and silicon. Optional accessories such as a grinding/lapping chamber enable fine-tuning of surface topography. AMAT / APPLIED MATERIALS Reflexion 3600 also features a range of safety features, including automatic inspection to ensure bevel and bottom profile uniformity throughout the process, as well as dynamic crash protection to stop the grinding/lapping process in case of an emergency. An isolation transformer is also included to protect against electrical shocks. AMAT Reflexion 3600 is designed to be both highly productive and cost-effective, with high throughput achieved through increased throughput-oriented controls, while high- and low-temperature compatibility enable a wide range of outer environmental conditions. Furthermore, the model is designed to perform maintenance itself, significantly reducing downtime while also reducing labor costs. Overall, APPLIED MATERIALS Reflexion 3600 is a powerful, affordable, and highly capable wafer grinding, lapping, and polishing equipment, featuring a range of advanced features that make it well-suited to production-level operations.
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