Used AMAT / APPLIED MATERIALS Reflexion 3600 #9379444 for sale
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ID: 9379444
Wafer Size: 12"
Vintage: 2003
CMP System, 12"
(3) Load ports
Does not include Hard Disk Drive (HDD)
(3) Platens, 30"
Maximum speed: 133 RPM
Pad conditioner, 4"
3 Type DDF, 30-120 RPM
Slurry line: Maximum 400 ml/min
Torque end point system
(4) Heads:
Membrane press head: 3 Zones 0-15 psi
Spindle speed: Maximum 200 RPM
Cleaner 1:
Megasonic cleaner
With (2) rollers and idler
DIW Flow: 2.01 / min
Temprature controller: 20° - 50°
Wafer rotation speed: 6 RPM
Power: 950 kHz, 600 W
Cleaner 2:
(2) Brushes
With (3) rollers and idler
Brush rotation speed: Maximum 700 RPM
Wafer rotation speed: Maximum 50 RPM
DIW delivery: 2000 ml/min
NH4OH: 2000 ml/min
Brush rinse:
DIW: 1000 - 4000 ml/min
Cleaner 3:
(2) Brushes
With (3) rollers and idler
Brush rotation speed: Maximum 700 RPM
Wafer rotation speed: Maximum 50 RPM
DIW Delivery: 2000 ml/min
FPM: 2000 ml/min
Brush rinse:
DIW: 1000 - 4000 ml/min
Dryer:
Spin rinse dryer
Maximum speed: 2500 RPM
Infrared ramp heater: 1000 W
2003 vintage.
AMAT / APPLIED MATERIALS Reflexion 3600 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to provide precise, fast, and consistent results throughout any wafer production process. Ideal for use in semiconductor and MEMS manufacturing, this system offers robust performance and versatility across a wide range of substrates, from metals to ceramics to glass. The 3600 is built with four independent grinding/lapping positions, enabling it to handle up to four substrates at a time for fast and efficient production. AMAT Reflexion 3600 features a load section that supports up to 200mm wafers with a capacity of 8 inches. The load section is fully encased in a stainless steel enclosure for maximum safety and performance. The adjustable loading and positioning table can accommodate substrates between 4 and 11 inches in diameter. The load section also includes advanced sensors and software that enable accurate substrate alignment and prevent misloading. APPLIED MATERIALS Reflexion 3600 also features a high-resolution optical viewing unit and X-axis/Y-axis motion machine to accommodate a wide range of substrate sizes and shapes. An integrated split frame tool is designed to enable precise placement of the substrate. The 3600's grinding/lapping process is powered by an advanced and highly precise servo control asset. This allows the operator to set precise and repeatable feed rates, grinding wheel speeds, and diamond wheel speeds to achieve optimal results. The model is also equipped with an advanced safety equipment to ensure operator safety. Reflexion 3600 is available with a wide range of upgrade options. It can be fitted with custom controllers for specific grinding, lapping, and polishing applications. It is also compatible with a wide range of custom grinding wheel, diamond wheel, and flat lap configurations. The 3600 also includes a powerful software suite that facilitates setup, automation, and process monitoring. In summary, AMAT / APPLIED MATERIALS Reflexion 3600 is a highly-advanced wafer grinding, lapping and polishing system that delivers precise and consistent results. This unit features a variety of advanced features and options to accommodate a range of substrates and applications. The machine is designed to provide a fast, efficient, and cost-effective production process.
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