Used AMAT / APPLIED MATERIALS Reflexion CMP #293655217 for sale

AMAT / APPLIED MATERIALS Reflexion CMP equipment is a unique process equipment that combines grinding, lapping, and polishing processes. This equipment is specifically designed for precision wafer finishing and polishing. The system applies innovative polishing and material removal technologies for a wide range of wafer production operations including back-side preparation, front-side clean, non-contact cleaning, optical profiling and other applications. The unit is equipped with a passively stabilized continuous-motion polisher and process head. The actively controlled polishing head is used to achieve precise removal of surface materials and is one of the most advanced process tools available in the market. The polisher features a rotating polishing pad and grinding disc, which are driven independently. This machine is designed to deliver high accuracy, repeatability, low wear, and minimal material loss, while providing a smooth and even finish. The Reflexion tool utilizes a unique combination of patented abrasive media and belt-less grinding, lapping, and polishing technology. This process is used to achieve an even and uniform surface finish on the polishing face of the wafer. The patented abrasive media is specifically designed for low curvature, low speed, and low deflection for consistent surface finish. The belt-less grinding and lapping process eliminates the need for an operator to supervise the operation, thus minimizing the possibility of product being over-processed. AMAT Reflexion CMP also includes an automated optical profiler that is used to measure the surface profile and condition of each wafer as it is processed. The optical profiler is integrated with the asset to provide automated quality control on the process. A built-in process controller ensures that the desired process parameters are followed and monitored to ensure that the optimal level of wafer finish is achieved. APPLIED MATERIALS Reflexion CMP is designed to be easy to use, with a user-friendly interface and intuitive workflow. The machine is highly efficient, with each wafer typically taking only a few minutes to complete the finishing process. The model is also highly reliable and can accommodate a wide range of substrate sizes, types, and thicknesses. Overall, Reflexion CMP equipment is an ideal solution for those looking to achieve a superior finish on the surface of their wafers. This system will provide high-precision results and will require minimal operator intervention, helping to reduce processing time, labor costs, and material loss associated with wafer production.