Used AMAT / APPLIED MATERIALS Reflexion LK Copper #293652092 for sale

AMAT / APPLIED MATERIALS Reflexion LK Copper Wafer Grinding, Lapping & Polishing Equipment is a multi-purpose wafer-processing system, ideal for abrasive appli­cations. It is designed to enable the process of grinding, lapping and polishing the substrate before metrology, thinning, and metallization processing. The unit is capable of producing a high quality, highly refined substrate surface. AMAT Reflexion LK Copper is a 5- or 6-chamber machine that utilizes a stepper motor-driven speed control. This enables the tool to achieve a very high level of accuracy and repeatability when grinding, lapping and polishing wafers. The asset allows for process parameters to be modified quickly, ensuring that processes are optimized to meet the specifications of the demanded applications. Furthermore, the model is able to achieve power, force and pressure control over the entire lapping and polishing process. APPLIED MATERIALS Reflexion LK Copper equipment is equipped with a variable pressure and temperature control system. This enables the unit to precisely regulate the pressing force, grinding speed, slurry temperature and apparent pressure, regardless of the type of the wafer material. The machine is able to generate uniform grinding conditions across all process areas, thereby increasing the process speed, precision and reproducibility. Reflexion LK Copper also incorporates a range of independent process motors, enabling a high degree of flexibility and customization of process parameters. The spacing between the motor and motor/slurry tanks is adjustable, allowing the tool to adapt optimally to different types of wafer materials. Furthermore, the asset is equipped with a built-in liquid and air filtration model, ensuring that the abrasive slurry is filtered quickly and without interruption. Finally, AMAT / APPLIED MATERIALS Reflexion LK Copper includes a touch-screen user interface and a comprehensive built-in library of recipes, enabling users to configure and store process data to optimise their process cycles as needed. Additionally, the equipment can be integrated with various metrology instruments, facilitating accurate and complete process analysis. In summary, AMAT Reflexion LK Copper Wafer Grinding, Lapping & Polishing System provides an excellent platform for abrasive applications involving grinding, lapping and polishing of wafers. Its combination of high accuracy, flexibility and user-friendly user interface ensure a successful process result.