Used AMAT / APPLIED MATERIALS Reflexion LK Prime #293808181 for sale
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ID: 293808181
Vintage: 2017
Chemical Mechanical Polishing (CMP) System
Hard Disk Drive (HDD)
No polishing head
2017 vintage.
AMAT / APPLIED MATERIALS Reflexion LK Prime is a high-performance wafer grinding, lapping, and polishing equipment used for a wide variety of applications from general semiconductor fabrication to MEMS prototyping. This system offers superior performance, accuracy, and flexibility to grind, lap, and polish wafers with high resolution precision and low surface roughness. Utilizing advanced technology, AMAT Reflexion LK Prime can simultaneously grind, lap and polish wafers to meet the most stringent process requirements. Ideal for R&D and production, APPLIED MATERIALS Reflexion LK Prime comes equipped with an IR ALD unit to control the bowing or warped edges of a wafer during grinding. This machine utilizes a unique arm-based, rigid and dynamic grinding platform to allow processing of wafers up to 200 mm wide, as well as realizing two separate grinding mechanisms designed to enable a very fine polishing. Additionally, a down spindle pressure sensor is available to provide stability and feedback on the grinding force applied to the wafer's surface. Reflexion LK Prime is capable of achieving low surface roughness values and superior edge quality with unmatched repeatability. In combination with a three-axis robot, an advanced touch sensing tool, as well as a dedicated machine vision asset, the model streams processing jobs and automatically sets the correct positioning at the ideal speed. Superior process control is achieved through highly sensitive pressure adjustment and coolant distribution along with integrated process control software. The advanced optical curvature measurement equipment ensures accurate wafer bow measurement for set up of LK Prime operation, as a result of which optically flat surfaces are achieved. Moreover, the system utilizes an integrated wafer curvature measurement technology to measure wafer curvature during the grinding process, enabling precise control of material removal. Additionally, AMAT / APPLIED MATERIALS Reflexion LK Prime utilizes a top-down, wafer-level-based approach, helping to ensure accurate process control. AMAT Reflexion LK Prime wafer grinding, lapping, and polishing unit is the ideal solution for applications requiring superior planarization, surface finish, and edge quality. The machine is backed by a powerful service team offering extensive after sales support to ensure that the tool provides continuous performance and meets the needs of a wide variety of applications.
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