Used AMAT / APPLIED MATERIALS Reflexion LK Prime #9163481 for sale
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ID: 9163481
Wafer Size: 12"
Copper CMP system, 12"
P/N:
124562901
123423700
Oxide CMP
Built on a GT platform
(4) Polishing heads
Oxide universal VR w/contour UPA
Pos 1 Polishing head type (E) contour CIP VR
Pos 2 Carrier (E) VR carrier for oxide contour CIP
Pos 3 Membrane (B) coated silicon Type B
Pos 4 Retaining ring (B) coated silicon Type B
Pos 5 Internal membrane clamp (A) IMC Type A
Pos 6 External membrane clamp (B) EMC Type B
Pos 7 Lower membrane clamp (A) LMC Type A
Full vision endpoint (3ms)
Platen temp control (10C) chiller
(2) Chem with onboard mixing, megasonic
(2) Chem with onboard mixing, module 3 LDM
(2) Chem with onboard mixing, module 4 LDM
Cleaner options desica dual process
Buffer tank
Buffer tank LDM DIW
Module 1: Input shuttle, LDM DIW
Module 2: 600W Megasonic, LDM 2 chem w/onboard mixing
Module 3: Brushbox CIP, LDM 2 chem w/onboard mixing
Module 4: Brushbox CIP, LDM 2 chem w/onboard mixing
Module 5: None, LDM
Module 6: Vapor dryer, LDM DIW.
AMAT / APPLIED MATERIALS Reflexion LK Prime is a powerful wafer grinding, lapping, and polishing equipment designed for efficiently processing both single-sided and double-sided semiconductor wafers. At the heart of the system is a multi-position, air-bearing spindle designed for precise grinding, lapping, and polishing. The spindle features air bearings on two axes that guide the rotating abrasives, allowing the unit to precisely control wafer planarizing, roundness, uniformity, and surface consistency. The LK Prime also features closed loop force feedback control and high precision wafer processing. This is combined with front and backside processing to provide enhanced process capability for advanced applications. The LK Prime's optional HMDS Oxidation Module allows for safe and efficient oxide film growth. The machine also features an advanced process control tool with integrated process recipes overview, error diagnostics and recipe control interface. This unique process control offers quick and easy process parameter setup, automatic wafer size detection, and fully automated recipe loading. The LK Prime is designed and manufactured for maximizing drive and throughput in wafer processing. Its flexible modular architecture allows for multiple wafer handler and integrated hardware interfaces, resulting in high wafer throughput. Additional features include in-line flat orientation station for achieving uniform wafer loading, integrated vacuum chuck for eliminating damage to processed wafers, and an embedded computer with easy-to-use user interface. The asset is designed for demanding production environments, and most importantly, it helps ensure repeatable and reliable wafer grinding, lapping, and polishing processes. To ensure the process maintains the highest standards of accuracy, the LK Prime's advanced process control model also offers integrated process recipe tracking, error diagnostics, and process parameter monitoring.
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