Used AMAT / APPLIED MATERIALS Reflexion LK #293596541 for sale

AMAT / APPLIED MATERIALS Reflexion LK wafer grinding, lapping and polishing equipment is designed to enable the highest accuracy, highest quality and highest throughput in semiconductor and compound material wafer processing. The LK system is a modular and scalable tool that can be customized to meet specific applications and provides a wide range of process capabilities including back grinding, precision lapping and polishing with ultra-precision machining and sub-micron surface finish. AMAT Reflexion LK unit is a precision machine that uses a combination of static force, guided cutting and fluid dispensing technology to reduce material removal time and enable high accuracy machining of wafers. The machine includes an advanced CNC control with an integrated material monitoring tool to ensure consistent process results. The control unit offers a range of process parameters that can be adjusted based on application and results. The integrated fluid delivery asset ensures controlled dispense of fluids during the process. APPLIED MATERIALS Reflexion LK model has a number of features which facilitate high-resolution lapping and polishing operations. These include the advanced surface grinding and polishing head, which offers a range of options such as diamond paste, polishing pads and wafer carriers. The equipment also has a patented static force suspension cushion which holds each wafer firmly in place, eliminating slippage during operation and ensuring a consistent surface finish in all applications. Reflexion LK system also offers an array of options such as high pressure cooling, wi-fi monitoring, high precision wafer tuning and a variety of other features that can further improve the process and accuracy of your lapping and polishing operations. AMAT / APPLIED MATERIALS Reflexion LK is a reliable and efficient wafer grinding, lapping and polishing unit that has been developed to meet the highest standards of accuracy, quality and throughput in semiconductor and compound material processing. This tool has a modular and scalable design, with a range of process parameters and process capabilities that can be completely customized to meet specific application requirements. Its advanced CNC control and integrated material monitoring machine ensure consistent process results and highly accurate machining of wafers. Its patented static force suspension cushion tool further enables a high level of accuracy and finish in all applications, and its wide range of options ensures optimal performance throughout the process.