Used AMAT / APPLIED MATERIALS Reflexion LK #293807807 for sale

AMAT / APPLIED MATERIALS Reflexion LK is a patented, state-of-the-art wafer grinding, lapping and polishing equipment designed to produce the highest quality bond interface for substrate-to-metal, substrate-to-semiconductor and other semiconductor applications. The system offers maximum precision for a variety of wafer sizes, shapes and materials, making it an ideal choice for nano-scale wafer fabrication. AMAT Reflexion LK utilizes a unique, three-axis diamond tool positioning unit to precisely grind, lap and polish small wafers up to 4" in diameter. This precision machine reduces undesired cutting force, resulting in higher yield and quality. The grinding and polishing cycles are tightly controlled, with pressure, rotational speed and temperature closely monitored. This enables precise control of the amount of material removed or added in the process. The precision of the tool is further enhanced by the use of in-situ laser gauging. This allows for real-time measurement and control of the material removal process, ensures process uniformity and increases asset accuracy. Furthermore, the collimator in the model ensures a small spot size, thus providing higher uniformity and accuracy. The wafer grinding, lapping and polishing cycle can be optionally extended to include a post-processing step, such as chemical mechanical polishing (CMP). The CMP process further enhances the wafer's precision by allowing for greater accuracy and surface flatness and improved wafer-to-wafer uniformity. APPLIED MATERIALS Reflexion LK is developed on a modular platform, making it extremely versatile and adaptable for a wide range of wafer fabrication applications. The equipment can be equipped with a number of optional components, such as an optical inspection system, a High Q (length stability) unit, and an autoloader for a smooth material-handling process. In conclusion, Reflexion LK is a top-of-the-line grinding, lapping and polishing machine that provides precise 3-axis diamond tool positioning. The tool offers uniformity, accuracy, and precision in a wide variety of wafer applications. With advanced features like laser gauging and CMP, AMAT / APPLIED MATERIALS Reflexion LK ensures wafer quality and uniformity, enabling increased yield and decreased time to market.