Used AMAT / APPLIED MATERIALS Reflexion LK #9005426 for sale
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ID: 9005426
Wafer Size: 12"
Vintage: 2010
Copper CMP system, 12"
Base System:
Reflexion LK 4 head, 3 platen polishing system, Dry in
Polisher Skins: Dark P1, P2, P3, and P4: 4910 compliant
Gap Wash: 120 degree nozzles
Load Cup Wafer Exchanger: Enhanced counter balance springs
Nova 3090 Ready: None
Monitor 1 Location Cart
Monitor 2 Location Ergo Arm type
Base System Light Tower: Factory Interface and Polisher Sides
Software:
LK Software Main system lp3B4.5_29
Factory Interface Front End fb4.9_14 Beta
ISRM / RTPC Endpoint system isB3.0_10
RTPC with within wafer uniformity control capability B3.0_11
Interface "A" High speed FDC data transfer: N/A
Nova 3090 Insitu Metrology System Software: No use
Wafer to Wafer iAPC: no use
Within Wafer iAPC: no use
Factory interface:
WIP Delivery Type OHT or manual delivery
FOUP Entegris F300
OHT Light Curtain LIGHT CURTAIN
E84 PI O Sensors and Cables: UPPER E84 SENSORS & CABLES
E99 Carrier ID TIRIS WITH RF
Docked E99 Reading Capability YES
Docking Flange Shield YES
Frame Configuration 4 WIDE
Load Ports Semi Compliant MENV and FIMS Assemblies
Load Port Operator Interface STANDARD
Load Port Types ENHANCED 25 WAFER FOUP
Operator Access Switch YES
Platen 1:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM RTPC
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter 1350-00195 (4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Platen 2:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter: 1350-00195(4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Platen 3:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter: 1350-00195(4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Polisher:
Polisher Technology SLURRY AND PAD
Polishing Head CONTOUR GEN III (0.5 TO 5.0 PSI)
Cross Break Pheumatic Box with Reverse Brake Logic
Pad Wafer Loss Sensor DARK PAD SENSOR
InterPlaten Clean Auxillary clean capability: No
ISRM Laser Key Switch Yes
Slurry Delivery System 5 x 10 CLC SDS
Head 1 Power Cable: 0150-16277 CABLE ASSY, HR1, DRIVER-MOTOR POWER, REF
Head 2 Power Cable: 0150-16278 CABLE ASSY, HR2, DRIVER-MOTOR POWER, REF
Head 3 Power Cable: 0150-16279 CABLE ASSY, HR3, DRIVER-MOTOR POWER, REF
Head 4 Power Cable: 0150-16280 CABLE ASSY, HR4, DRIVER-MOTOR POWER, REF
Head 1 Encoder Cable: 0150-16281 CABLE ASSY, 300MM, HR1, DRIVERRESOLVER
Head 2 Encoder Cable: 0150-16282 CABLE ASSY, 300MM, HR2, DRIVERRESOLVER
Head 3 Encoder Cable: 0150-16283 CABLE ASSY, 300MM, HR3, DRIVERRESOLVER
Head 4 Encoder Cable: 0150-16284 CABLE ASSY, 300MM, HR4, DRIVERRESOLVER
G4+ UPA Water rated valves: SMC UPA
G4+ UPA UPA Firmware: SMC UPA
Cleaner Meg:
MEGASONICS Delivery with onboard Mix
Transducer MEGASONICS Transducer
Chemical 1 CLC 1-250 ml/min
Chemical 2 CLC 1-250 ml/min
Brush box 1:
Brush LDM Type: TwoChemInLineMixed
Chemical 1: CLC 0~1250 ml/min
Chemical 2: CLC 0~1250 ml/min
Brush Box Level Spacer: 6mm Spacer for HH alarm reduction
Brush Box Shaft Enhanced tolerance shaft
Toe In Bracket design to allow for Toe In adjustment
Slow drain Plumb to main drain line
Brush box 2:
Brush LDM Type: TwoChemInLineMixed
Chemical 1: CLC 0~1250 ml/min
Chemical 2: CLC 0~1250 ml/min
Brush Box Level Spacer: 6mm Spacer for HH alarm reduction
Brush Box Shaft Enhanced tolerance shaft
Toe In Bracket design to allow for Toe In adjustment
Slow drain Plumb to main drain line
Dryer module:
Dryer Type VAPOR DRYER
Recovery Module CHEM DELIVERY TANK W/5 WAFER BRACKET
Output Station Dampner: Cap is Viton
2010 vintage.
AMAT / APPLIED MATERIALS Reflexion LK is a high-performance wafer grinding, lapping & polishing equipment that provides an unparalleled level of performance and reliability. It is designed to handle a wide variety of substrates including Silicon, Sapphire, and other materials. The system is comprised of an advanced, multi-axis stage assembly that enables precise indexing, grinding, lapping, and polishing of wafers as well as large substrates at ultra-high throughput. The design of AMAT Reflexion LK provides maximum flexibility and user control of substrate process steps and enables a wide range of applications, such as wafer thinning, backside polishing, and surface preparation. APPLIED MATERIALS Reflexion LK enables users to adjust the grinding, lapping, and polishing parameters to meet run-to-run and substrate-to-substrate requirements. This allows for fine-tuning to help optimize the process results for best-in-class feature size and surface quality in line with user requirements. Additionally, Reflexion LK features a fast and efficient substrate orientation change that can transition from step to step without any manual intervention. AMAT / APPLIED MATERIALS Reflexion LK includes a wide range of features designed to improve process consistency, robustness, and throughput. These include an integrated vision unit, active tuning of springs, and High-Dynamic Follow Across Control (HDFA), which provides increased shot uniformity for critical process applications. Additionally, AMAT Reflexion LK utilizes integrated calibration utilities, which reduce long-term drift and improves the stability of performance over time. APPLIED MATERIALS Reflexion LK's high-performance environment provides a number of process and product protection features to ensure the highest quality substrate finish and reliable cycle-after-cycle performance. These features include a noise-minimizing environment, active instrument calibration, and an advanced cooling machine that dissipates heat away from the substrates to ensure minimal thermal stress. In conclusion, Reflexion LK is a highly capable tool for wafer grinding, lapping & polishing that provides consistent, repeatable, and reliable results. It offers maximum flexibility to meet the unique manufacturing needs of a wide range of substrates and applications, while providing a wide range of process and product protection features to ensure the highest quality process results and long-term reliability.
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