Used AMAT / APPLIED MATERIALS Reflexion LK #9023774 for sale

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ID: 9023774
W CMP systems.
AMAT / APPLIED MATERIALS Reflexion LK is a high-precision wafer grinding, lapping and polishing equipment designed for the production of flat and optically perfect silicon wafers. This system is used for the complete fabrication of high-quality thin silicon wafers with a thickness of 8-125 μm. The unit is based on a series of advanced technologies, which include a high-precision Direct Drive motor machine, motion control using matched Flexible Coupling and Synchronization Units, and a high-performance Active Fluid Cooling Tool. The Direct Drive motor asset ensures precise control over the grinding/lapping process, while the Flexible Coupling and Synchronization Units provide accurate motion synchronization between the grinding/lapping axes. The Active Fluid Cooling Model provides a reliable source of cooling for the entire equipment. AMAT Reflexion LK also features a modular design, which enables users to switch between different types of grinding/lapping processes. This system can also accommodate various configurations, such as single-sided grinding/lapping or double-sided grinding/lapping. The unit is equipped with a high-speed flat polishing platen which is designed to provide precise flatness and smoothness of the processed wafers. APPLIED MATERIALS Reflexion LK is engineered for maximum efficiency, reliability and safety. It is equipped with sophisticated safety features, including a multiple-failure safety machine, software-based monitoring tool and multiple interlocks to protect the asset and prevent accidents. These safety features help protect the operator as well as the model from any potential harm. Reflexion LK is an ideal tool for silicon wafer processing, and is suitable for a wide range of applications, such as MEMS, LED, and IC process related technologies. This equipment is capable of producing flat and optically perfect wafers without any blemishes, and is ideal for high-precision and ultra-sensitive silicon processes. It is also designed to achieve extremely smooth flatness with maximum productivity and accuracy.
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