Used AMAT / APPLIED MATERIALS Reflexion LK #9116998 for sale
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ID: 9116998
Copper CMP system, 12"
Base system:
Reflexion LK: 4-head, 3-platen, polishing system
Dry in, dry out
Polisher skins: Dark P1, P2, P3, P4; 4910 compliant
Gap wash: 120° nozzles
Load cup wafer exchanger: enhanced counter balance springs
Nova 3090 ready: none
Monitor 1 location: cart
Monitor 2 location: ergo arm type
Light tower: factory interface and polisher sides
Software:
LK Software: lp3B4.5_29
Factory interface: b4.9_14 Beta
ISRM / RPTC: isB3.0_10
RTPC: B3.0_11
Platen 1:
Platen type: high speed (<=350 RPM)
Endpoint: RTPC
High pressure rinse flow meter: 1350-00195 (4.6 L/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse arms: high pressure/flow
Flow meter: 50-500 mL/min
Temperature control: platen cooling water
Platens 2,3:
Platen type: high speed (<=350 RPM)
Endpoint: full scan optical ISRM
High pressure rinse flow meter: 1350-00195 (4.6 L/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse arms: high pressure/flow
Flow meter: 50-500 mL/min
Temperature control: platen cooling water
Polisher:
Polisher technology: slurry and pad
Polishing head: Contour Gen III (0.5 to 5.0 psi)
- (6) Zones
- Maximum pressure: RR (15 psi), Z1 (10 psi), Z2 (5 psi), Z3 (5 psi), Z4 (5 psi), Z5 (5 psi)
Cross break: N/A
Pad wafer loss sensor: dark pad sensor
Inter-platen clean: no
ISRM Laser key switch: yes
Slurry delivery system: 5 x 10 CLC SDS
Head 1 Power Cable: 0150-16277CABLE ASSY, HR1, DRIVER-MOTOR POWER, REF
Head 2 Power Cable: 0150-16278CABLE ASSY, HR2, DRIVER-MOTOR POWER, REF
Head 3 Power Cable: 0150-16279CABLE ASSY, HR3, DRIVER-MOTOR POWER, REF
Head 4 Power Cable: 0150-16280 CABLE
ASSY, HR4, DRIVER-MOTOR POWER, REF
Head 1 Encoder Cable: 0150-16281CABLE ASSY, 300MM, HR1, DRIVER-RESOLVER
Head 2 Encoder Cable: 0150-16282CABLE ASSY, 300MM, HR2, DRIVER-RESOLVER
Head 3 Encoder Cable: 0150-16283CABLE ASSY, 300MM, HR3, DRIVER-RESOLVER
Head 4 Encoder Cable: 0150-16284CABLE ASSY, 300MM, HR4, DRIVER-RESOLVER
G4+ UPA: SMC UPA
G4+ UPA: SMC UPA
Cleaner meg:
Chemical 1:CLC 1-250 ml/min
Chemical 2:CLC 1-250 ml/min
Brush box 1:
Chemical 1: 0-1250 ml/min
Chemical 2: 0-1250 ml/min
Brush box 2:
Brush LDM Type: 2-chem, inline, mixed
Chemical 1: 0-1250 ml/min
Chemical 2: 0-1250 ml/min
Dryer module:
Dryer type: vapor dryer
Recovery nodule: N/A
Output station damper: Viton cap
2010 vintage.
AMAT / APPLIED MATERIALS Reflexion LK is a state-of-the-art wafer grinding, lapping, and polishing (G/L/P) equipment that offers superior control and precision during semiconductor manufacturing. The system features an integrated workstation with large flat plate grinding, lapping, and polishing blocks; an automated one- or two-sided grinding/lapping platform; a high speed loader/unloader; and a full suite of process and parameters monitoring, control, and analysis tools. The integrated driving unit and high precision, low-load bearing mechanism enables high level of repeatability and accuracy. AMAT Reflexion LK machine has a very rugged construction for strong performance and long-term durability. An advanced heater and cryogenic cooling stage are integrated into the tool to provide a highly repeatable thermal expansion coefficient, ensuring a consistent finish on multiple wafer lots. With its low noise and vibration, the asset delivers excellent result with minimum damage to delicate wafers. The one-sided grinding/lapping plate has a total load capacity of 400 kg and offers uniform and precise over travel. A combined main and second stage grinding action is supported to achieve the desired surface finish. Its flatness is ensured by high-precision rail-guided linear motion, which, together with the adjustable compensator, keeps any differences in base surface down to 0.002 mm/m. Moreover, APPLIED MATERIALS Reflexion LK model comes with a user-friendly software interface, allowing complete process control. Any parameters that need adjusting can be changed with the click of a button. The software is also integrated with a modern visualization equipment which can display data in 3D graphics. Overall, Reflexion LK system is a powerful, reliable, and user-friendly wafer grinding, lapping, and polishing unit that provides superior performance and accuracy. It is ideal for semiconductor manufacturers who demand superior results in the shortest time.
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