Used AMAT / APPLIED MATERIALS Reflexion LK #9351487 for sale

AMAT / APPLIED MATERIALS Reflexion LK is a high-precision grinding, lapping, and polishing equipment for substrates used in semiconductor and optical fabrication. This system enables users to perform processing operations with extremely high accuracy and repeatability. It features a bridge-type configuration that allows for parallel wafer handling and uniform processing. Additionally, the platform utilizes a proprietary process cell design with a robotic unit to load wafers and deliver high-precision grinding and lapping results. The machine operates by rotating the wafer in the direction of the lapping motion and using vibration and pressure sensors to transfer data to the computer-controlled grinding and lapping head. AMAT Reflexion LK has multiple tool components, including a grinding and lapping head, a wafer chuck, an automated wafer handling asset, a vision model, an edge sensor, and a robot equipment. The grinding and lapping head consists of the lapping table, motors, and grinding stones. The built-in vision system uses line scan cameras to detect and align the wafers with the lapping head. This is supported by the edge sensor, which measures the surface quality of the wafers after each grinding and lapping process. The robot unit is used to move the substrates from the wafer chuck to the lapping table, and vice versa. This machine features an in-situ measurement and control tool which continuously provides feedback to monitor and adjust the process parameters in real-time. Additionally, the asset has a high degree of accuracy and repeatability, which enables users to get consistent results with minimal manual intervention. This is achieved through an automated wafer handling model and the wafer chuck, which is designed to minimize the effects of operator handling. APPLIED MATERIALS Reflexion LK also has several safety features, such as sensors for controlling the grinding and lapping pressure and pressure and vibration monitoring. Finally, this equipment includes software packages and user-friendly interfaces that allow users to control and analyze the results of each lapping process. The software packages also allow users to analyze the lapping data and provide the necessary visualization and statistical analysis to achieve the desired results. The user-friendly interfaces enable users to input the required process parameters and to monitor the progress of the wafer grinding and lapping processes.