Used AMAT / APPLIED MATERIALS Reflexion LK #9372768 for sale

AMAT / APPLIED MATERIALS Reflexion LK
ID: 9372768
Wafer Size: 12"
CMP System, 12" Process: Tungsten.
AMAT / APPLIED MATERIALS Reflexion LK is a wafer grinding, lapping and polishing equipment designed to process wafer substrates from 200mm to 450mm in diameter. The system has the capability to process substrates to the highest possible polish, resulting in the most defect free surfaces for leading-edge device manufacturing. The unit consists of a CNC controlled substrate handler, grinder, lapper, polisher, and Diamond Slurry Distribution Machine. The CNC handler moves the substrate in the X, Y, and Z directions and provides full 3D positioning control. The handler is designed to maintain the substrate's roughness and surface flatness while providing three degrees of wafer orientation and adjustable handle force. The grinder is a high-torque rotary tool that removes high-spots and surface roughness from the wafer substrate. It comes with a high-pressure transducer and a PID-controlled asset for fast and accurate grinding. The lapper features a two stage high-pressure pad model for rapid and uniform lapping. The integrated pressure transducer ensures consistent pressure for uniform layers. The polisher comes with a high-torque rotary equipment for active and passive motion control. It has an integrated PID pressure control system that allows for precise lapping and polishing. Finally, the Diamond Slurry Distribution Unit is designed to provide uniform diamond slurry distribution and sediment removal. It uses a proprietary pulsed withdrawal metering machine to control the release of slurry over time. This ensures uniform diamond deposition on the wafer during the lapping and polishing processes. Overall, AMAT Reflexion LK is an advanced wafer grinding, lapping and polishing tool designed to produce defect-free surfaces at the highest possible polishing level. Its CNC controlled handler and integrated diamond slurry distribution asset allow for precise and uniform lapping and polishing. Its robust and reliable design makes it one of the most advanced systems for processing next-generation devices.
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