Used AMAT / APPLIED MATERIALS Reflexion #293600686 for sale

ID: 293600686
Wafer Size: 12"
Vintage: 2006
CMP System 2006 vintage.
AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing equipment is a precision solution for grinding, lapping and polishing of large or small wafers. AMAT Reflexion is specifically designed to meet the demands of wafer processing, providing increased throughput, reduced operating costs and better yields. The system combines the high accuracy of a robotic microscope manipulator, vacuum chuck technology and water-cooled, high-pressure grinding techniques into one compact unit. The machine uses a vacuum chuck to hold the wafers in place, ensuring accurate motion and superior cycle times. The robotic microscope manipulator provides precise and repeatable motion with a repeatability of 0.003mm at normal pressures. The high accuracy of the robotic manipulator in combination with the vacuum chuck technology ensures consistent and repeatable wafer grinding results. APPLIED MATERIALS Reflexion tool is equipped with water-cooled, high-pressure grinding techniques to maximize polishing efficiency. The asset contains a mixing chamber that evenly distributes the grinding head and diamond slip ring over the wafer, as well as a high-speed wafer aligner that rapidly adjusts angle and orientation of the wafer. With the wafer in place, Reflexion model applies up to 17,500 gallons per minute of grinding media to the wafer's surface. This controlled high-pressure grinding process ensures uniform and precise polishing of the wafer. AMAT / APPLIED MATERIALS Reflexion can also be used for lapping and polishing. The equipment includes a large selection of polishing ranges and rubber pads for precise and repeatable performance. The polishing pads are designed to provide superior wafer surface uniformity, and the adjustable pressure and speed settings enable the system to handle a variety of wafers without compromising quality. AMAT Reflexion Wafer Grinding, Lapping & Polishing Unit is designed to meet the most demanding wafer processing needs. The machine is highly precise, repeatable and efficient, and offers superior yields and reduced operating costs. APPLIED MATERIALS Reflexion is an ideal choice for both small and large scale wafer fabrication operations.
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