Used AMAT / APPLIED MATERIALS Reflexion #9056492 for sale

AMAT / APPLIED MATERIALS Reflexion
ID: 9056492
Wafer Size: 12"
Vintage: 2003
CMP system, 12", 2003 vintage.
AMAT / APPLIED MATERIALS Reflexion, is a wafer grinding, lapping and polishing equipment designed to enable semiconductor manufacturers to effectively apply MEMS processing and fine grinding to produce ultra-flat, damage-free surfaces for MEMS components. AMAT Reflexion is configured with an automated 6-axis Robot wielding 5" and 6" carbide lapping plates, diamond pads and slurry trays. The automated Robot arm moves the grinding tools on a finely balanced multi-axis program to achieve superior surface flatness and uniform thickness across a wide variety of materials. APPLIED MATERIALS Reflexion is also equipped with Precision Monitoring and Navigation (PMN) technology which enables the Robot to accurately measure heights, angles, distances and other parameters of the grinding surface and dispense the right amount of abrasive media according to the required specification. In addition, a state-of-the-art closed-loop control system constantly monitors the process to ensure the highest quality grinds are produced. The unit is also equipped with a vision machine which scans the incoming material and assesses any imperfections or defects during the grinding process. Reflexion is also equipped with a Dust Collector with a filterless design which enables a clean wafer handling environment with no contamination of the processed wafers. The tool also has a three-axis Particulate Counter which prevents contamination by measuring particles of embedded abrasive grains. AMAT / APPLIED MATERIALS Reflexion also features a touchscreen interface which enables easy operational control, data logging and real-time monitoring. AMAT Reflexion is scheduled and optimized with a software program to ensure smooth operation and efficient use of grinding tools. The asset is readily integrated with other systems in a production line, simplifying the process and protecting downstream equipment from abrasion or contamination with abrasive matter. Additionally, APPLIED MATERIALS Reflexion can handle a wide variety of common materials used in MEMS manufacturing and supports a range of polishing speeds, up to 0.5 microns per second. Reflexion has been designed for high levels of performance and reliability, enabling semiconductor manufacturers to produce components with perfect surfaces for MEMS applications. This is an advanced model for grinding and polishing, ideal for use in the semiconductor industry.
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