Used AMAT / APPLIED MATERIALS Reflexion #9115323 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing Equipment is a high-performance solution for achieving the desired surface parameters on semiconductor wafers. This system is designed to provide high-quality results with a minimal amount of time and effort. It is designed to address a variety of wafer size requirements, including those used in the production of integrated circuits (ICs). The unit utilizes two pairs of abrasives: a diamond grinding wheel and a diamond lapping plate. The diamond grinding wheel is outfitted with diamond abrasive particles, which are used to grind and prepare the wafer surface. After the grinding process is complete, the diamond lapping plate is utilized to finish the surface. This plate has diamond abrasive particles of different sizes to provide the necessary precision and consistency for producing optimal results. AMAT Reflexion machine is also equipped with a polishing mechanism. This mechanism utilizes two polishing tools: a polishing pad and a felt pad. The polishing pad is composed of a resin-reinforced ceramic material that is designed to keep aggressive contact with the wafer while it is being polished. An adjustable pressure lever controls the amount of pressure that is applied to the wafer. The felt pad works in tandem with the polishing pad to ensure an even polishing surface. The tool is designed to provide precise, repeatable results with a maximum level of wafer grinding and polishing accuracy. An integrated vision asset operates in conjunction with the grinding and polishing stages and can be used to increase the quality of the finished surface. Furthermore, the model is IEEE-488 compliant, meaning that it is compatible with automated control and monitoring systems. Other features of the equipment include a grinding/lapping arm for precise handling of the wafer surface, adjustable workpiece cleaning fixtures for removing contamination and debris, and a corrosion-resistant stainless steel base for housing the system components. Additionally, APPLIED MATERIALS Reflexion unit has a user-friendly graphical user interface and can be integrated with other software and automation tools. Overall, Reflexion Wafer Grinding, Lapping & Polishing Machine is a reliable and precise solution for achieving precise and repeatable results for a variety of semiconductor wafer sizes. The tool is designed to provide high-quality results with a minimal amount of time and effort. It is also easy to use and can be integrated with other software and automation tools.