Used AMAT / APPLIED MATERIALS Reflexion #9156629 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing Equipment is an equipment for advanced semiconductor manufacturing that produces superior quality semiconductor wafers. The system is ideal for flat and curved wafer processing, combining the best of mechanical and chemical processes to achieve accuracy, repeatability and throughput at an affordable price. AMAT Reflexion unit utilizes both traditional and advanced grinding, lapping, and polishing methodologies. It starts with wafer mounting in a vacuum environment and then a thirty-minute low temperature pre-process deburr cycle. This removes large particles and small enough particles that may adversely effect the process. The deburring step is designed to minimize edge bursting. APPLIED MATERIALS Reflexion machine them moves on to a grinding and lapping process to further refine the wafer shape and size to a specified thickness as well as to polish the wafer surface. This process also provides oil/resin cleaning of the wafer surfaces. This step provides superior flatness and edge finishing characteristics to the wafer. Finishing is accomplished by the application of chemical-mechanical polishing (CMP) process. This process is done in concert with blanket polishing and then with the post-polish CMP (PP-CMP) modules. The CMP process utilizes a high-pressure water jet to help chemically etch away any surface irregularities and then the addition of a polishing compound, such as diamond abrasive, to polish away the defects and create the desired level of surface finish. The final step in the tool is the passivation of the wafers, which is done to create a protective surface finish to the wafer that will help increase the strength of the wafer and also protect them from oxidation. Reflexion asset also offers a "low-temperature annealing" process, which helps to strengthen the silicon and leads to even higher yields. Overall, AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing Model is an all-in-one, comprehensive wafer processing equipment that can help meet the most advanced requirements in precision and repeatability, while maintaining cost effectiveness. It is a perfect choice for semiconductor fabrication facilities that need to produce high-quality wafers.