Used AMAT / APPLIED MATERIALS Reflexion #9182257 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing Equipment is a revolutionary fabrication technology for the semiconductor industry. This multi-purpose system provides an efficient and cost-effective way to produce complex, high-precision wafers in a single step. It combines lapping and polishing operations into a single integrated machine, offering versatility, repeatability and scalability. AMAT Reflexion unit includes precision mechanical components and a comprehensive suite of advanced automation and process control software. It is built with a strong frame and utilizes two wafer grinding wheels to produce precise wafers. The grinding motors are electronically controlled and receive positional feedback from a precision gauge which also monitors the vacuum holding force of the wafers. APPLIED MATERIALS Reflexion machine offers efficient wafer lapping and edge profiling to produce precise wafer geometries. It utilizes auto-lapping modules to provide automated control and monitoring of the lapping operation. The spindle is programmed to adjust the load and the speed of the polishing pads at different phases of the process. A precise air pressure delivery tool delivers pressurized air to the pads to generate an even polished surface. Reflexion also incorporates precise wafer polishing. This is achieved using patented abrasive pads that are designed to perfectly match the wafer profile and topography. The polishing module offers automated control of the pad vs. wafer contact force during the polishing process. A precise polishing solution is delivered to the polishing pads and the built-in cleaning asset minimizes the potential for contamination. AMAT / APPLIED MATERIALS Reflexion model offers total in-line qualification, with traceable process records. This provides the user with accurate and repeatable process results as well as records of individual wafer geometries, surface roughness, flatness and other critical process parameters. This allows for the verification of process yield, downtime, repeatability and other important process parameters. AMAT Reflexion Wafer Grinding, Lapping & Polishing Equipment is a superior innovative solution for the semiconductor industry. It provides an efficient and cost-effective way to produce complex, high-precision wafers in a single step, offering unmatched versatility, repeatability and scalability.