Used AMAT / APPLIED MATERIALS Reflexion #9225982 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping and Polishing Equipment is a comprehensive solution for producing high-precision, ultra-smooth flat surfaces and edges on a range of semiconductor substrates and other rigid materials. The system is designed to produce flats that are smoother than any other unit available and can give uniformity across multiple wafer substrates. The machine is composed of a main unit and a control station. The main unit is composed of several components including two grinding spindles, two lapping plates, three polishing stations, two electronic controllers, a cartridge filter unit and one or more power supply units. The grinding spindles are responsible for grinding, grinding openings and knife/blade cutting. The lapping plates are responsible for simultaneous grinding, lapping, and polishing of all flat surfaces and handles of both, usually square and rectangle substrates. The polishing stations are responsible for creating a uniform, mirror finish of the required flat surfaces and edges. The electronic controllers control all of the various aspects, speeds, and times of the individual components. The power supply unit provides power to all components, ensuring continuous output and reliable operation. The main unit is then connected to the control station, or operator interface. This station is composed of a touchscreen, a keyboard for inputting commands, three loading/unloading positions and isolation to protect the operating staff from any harmful particles. The control station is the "brain" of the tool and is responsible for managing the entire process, from loading, grinding, lapping, polishing, and unloading, as well as for monitoring and controlling other parameters of the asset. The operator interface is also responsible for collecting data and making sure that all required parameters are within certain values. It also has an extensive library of pre-programmed functions and settings. This enables it to maintain consistent results while giving the operator more options to adjust the parameters and make more complex surfaces. AMAT Reflexion Wafer Grinding, Lapping and Polishing Model is a highly advanced solution designed to create perfectly flat and smooth surfaces on a wide range of materials. With its high degree of automation, powerful features and user-friendly design, the equipment offers an efficient and cost-effective solution for meeting surface finish requirements. Its advanced technology, accuracy and reliability make it an ideal option for producing high-precision parts for a wide range of applications.