Used AMAT / APPLIED MATERIALS Reflexion #9275009 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing Equipment is an advanced, yet cost-effective mirror finish preparation solution for semiconductor and MEMS applications. This system brings best-in-class accuracy and efficiency to the production process, providing fast and repeatable processes optimized for high-throughput, low-cost mirror finish preparation. AMAT Reflexion Unit features a unique patented design which includes a three-stage automated rotary head operation and a multi-zone wafer loading machine. The unique design allows the user to navigate through three distinct grinding and polishing stages, using a single machine. The first stage uses a belt-driven spindle with a water cooled, diamond abrasive belt that moves against a stationary copper-based, self-centring platen. This stage prepares the wafer surface for further operations. The second stage uses a rotary polishing head to apply a layer of slurry to the wafer's surface, which is then abraded by the action of the rotating head. The third stage is an optically controlled finish operation, which provides the desired mirror finish to the wafer's surface. APPLIED MATERIALS Reflexion Tool is equipped with automated and programmable features to ensure repeatability, which is the key to obtaining uniform mirror finishes - and in the process, improving device performance. The asset offers a wide variety of customizability and configurability options, such as selectable grind/polish times and aqueous chemistry variables. Additionally, this model features a high-precision, load-bearing granite base to ensure stable and rigid performance, irrespective of the processing temperature. Reflexion Equipment is specifically designed to meet the challenges of high-precision, low-cost mirror finish preparation process. Its high throughput and low cost of operation make it an attractive option for a variety of semiconductor and MEMS applications. Coupled with technical support, better performance and improved yields can be consistently realized from the system.