Used AMAT / APPLIED MATERIALS Reflexion #9294262 for sale

AMAT / APPLIED MATERIALS Reflexion is a powerful wafer grinding, lapping, and polishing equipment designed to meet the most demanding requirements of precision semiconductor device fabrication. This system offers accurate, self-leveling alignment to the exact surface topography of the wafer and provides outstanding surface quality of the processed wafer surface. It has a high-speed wafer rotation and tilt mechanism equipped with a rugged motor-drive unit which enables precise and uniform alignment to the desired spatial position of the wafer. The machine consists of an open-bottom spindle housing, a three-axis chuck stages, a flat platen and an integrated high-pressure coolant nozzles for efficient chip removal during polishing. The tool also features an optically sensed grinding force level to ensure optimal performance by precisely monitoring and controlling the grinding force. The grind speed is also adjustable so that the optimum speed is provided for better surface integrity. The platen motion is highly adjustable and the asset allows for grinding of the wafer at different angles and positions. In addition, the model is equipped with a unique wafer-holding device which ensures proper wafer position and ensures that complete wafer coverage is achieved during grinding. The equipment's high-power, high frequency ultra-sonic grinding operation provides excellent material removal rates, resulting in better surface integrity and quality. It also features integrated vision-based process control which accurately controls and monitors the entire process and ensures that optimal results are achieved. AMAT Reflexion is designed for use with a variety of industries in a variety of applications such as wafer grinding, lapping and polishing. Furthermore, APPLIED MATERIALS Reflexion system has undergone a number of improvement and advancements to improve its capabilities, including the use of a high-speed polisher head and a robotic wafer handling unit. This machine has a comprehensive range of process capabilities and is used in a variety of production scenarios, ranging from small-to-large volume production. The tool also offers a variety of safety measures, such as safety shutters and guarding, to ensure the asset is safely used. Overall, Reflexion model is a powerful wafer grinding, lapping, and polishing equipment that can easily meet the demands of the modern semiconductor device fabrication process. It offers accurate, self-leveling alignment, high-speed wafer rotation and tilt mechanism, as well as a high-precision, high-frequency ultrasonic grinding operation. Furthermore, the machine also features integrated vision-based process control and a comprehensive range of process capabilities.