Used AMAT / APPLIED MATERIALS Reflexion #9311884 for sale

AMAT / APPLIED MATERIALS Reflexion
ID: 9311884
Wafer Size: 12"
Vintage: 2002
CMP System, 12" Process: Tungsten Polisher: Clean dry air and nitrogen: Maximum flow 30 SCFM De-Ionized Water (DIW): Maximum 5.8 GPM Slurry (1-3): 600 SCCM Exhausts: Maximum 150 CFM AC Power: 208 V, AC 5% Cleaner: Nitrogen maximum: 3 SCFM Clean dry air maximum: 13.4 SCFM De-ionized water (DIW) maximum: 4.0 GPM Process cooling water maximum: 1.8 GPM AC Power: 208 V, AC 5% FI Specification: Vacuum: 12.6 psig Clean dry air maximum: 20 SCFM AC Power: 208 V, AC 5% Polisher configuration verification: (4) Polishing heads: 12" Titan profiler 2.1 Polisher head: (4) Zones ISRM: P1 Full scan, P2 scan (3) Pad conditioners (3) Pad conditioner heads modify to cylinder type Slurry: Line A, B, C / (2) Peristaltic pumps ENTEGRIS Flow controller X3, NT Flow controller X1 Polisher platen without cooling function LCWE Input / Output type edge type wet robot Cleaner configuration verification: Wet robot in KAWASAKI mode P490 Connector missing FI Configuration verification: KENSINGTON Robot (3) Load ports Operating system: Windows XP 2002 vintage.
AMAT / APPLIED MATERIALS Reflexion is a wafer grinding, lapping and polishing equipment designed and built for the semiconductor industry. It can be used for all stages of wafer fabrication, from initial preparation of the wafer surface to the final polish required for device fabrication. The system is based on a state-of-the-art robotic grinding and polishing arm and precision controller with a built-in tilting mechanism to perform wafer grinding and polishing operations. The grinding and polishing arm is equipped with a spindle and precision slide bearing assembly, controlling both the direction and force applied to the wafer surface. The controller is capable of managing several grinding/polishing operations, and can track and record the progress of all operations within the unit. AMAT Reflexion is equipped with a range of wafer fixtures to hold the wafer securely while grinding and polishing operations are performed. The fixtures are designed to accommodate different sizes and shapes of wafers and can be quickly interchanged to accommodate different processes. The machine also incorporates a range of vacuum/gas systems to facilitate the efficient removal of material ground from the wafer surface. With a modular design, the tool can be easily configured for different process conditions such as high speed grinding and polishing operations, in-process measurement of wafer surface quality, and online surface condition monitoring. APPLIED MATERIALS Reflexion also has built-in safety measures to ensure safe control of the grinding and polishing operations. It comes with audible and visual alarms that can be attached to any process stage, to signal a worker if a defect is detected or an incorrect process setting is selected. It also has software enabled process safeguards that can detect any unexpected changes in process parameters and abort the process if any such changes are detected. Finally, the asset is able to successfully switch between different Grinding/Polishing processes with minimal user intervention. In sum, Reflexion is a highly advanced wafer grinding and polishing model, combining state-of-the-art robotics, precision controllers, and a range of fixtures and safety measures to provide efficient control of the entire process. This ensures that consistently high-quality results are achieved even in the most demanding production environments.
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