Used AMAT / APPLIED MATERIALS Reflexion #9311884 for sale
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ID: 9311884
Wafer Size: 12"
Vintage: 2002
CMP System, 12"
Process: Tungsten
Polisher:
Clean dry air and nitrogen: Maximum flow 30 SCFM
De-Ionized Water (DIW): Maximum 5.8 GPM
Slurry (1-3): 600 SCCM
Exhausts: Maximum 150 CFM
AC Power: 208 V, AC 5%
Cleaner:
Nitrogen maximum: 3 SCFM
Clean dry air maximum: 13.4 SCFM
De-ionized water (DIW) maximum: 4.0 GPM
Process cooling water maximum: 1.8 GPM
AC Power: 208 V, AC 5%
FI Specification:
Vacuum: 12.6 psig
Clean dry air maximum: 20 SCFM
AC Power: 208 V, AC 5%
Polisher configuration verification:
(4) Polishing heads: 12" Titan profiler 2.1
Polisher head: (4) Zones
ISRM: P1 Full scan, P2 scan
(3) Pad conditioners
(3) Pad conditioner heads modify to cylinder type
Slurry: Line A, B, C / (2) Peristaltic pumps
ENTEGRIS Flow controller
X3, NT Flow controller X1
Polisher platen without cooling function
LCWE Input / Output type edge type wet robot
Cleaner configuration verification:
Wet robot in KAWASAKI mode
P490 Connector missing
FI Configuration verification:
KENSINGTON Robot
(3) Load ports
Operating system: Windows XP
2002 vintage.
AMAT / APPLIED MATERIALS Reflexion is a wafer grinding, lapping and polishing equipment designed and built for the semiconductor industry. It can be used for all stages of wafer fabrication, from initial preparation of the wafer surface to the final polish required for device fabrication. The system is based on a state-of-the-art robotic grinding and polishing arm and precision controller with a built-in tilting mechanism to perform wafer grinding and polishing operations. The grinding and polishing arm is equipped with a spindle and precision slide bearing assembly, controlling both the direction and force applied to the wafer surface. The controller is capable of managing several grinding/polishing operations, and can track and record the progress of all operations within the unit. AMAT Reflexion is equipped with a range of wafer fixtures to hold the wafer securely while grinding and polishing operations are performed. The fixtures are designed to accommodate different sizes and shapes of wafers and can be quickly interchanged to accommodate different processes. The machine also incorporates a range of vacuum/gas systems to facilitate the efficient removal of material ground from the wafer surface. With a modular design, the tool can be easily configured for different process conditions such as high speed grinding and polishing operations, in-process measurement of wafer surface quality, and online surface condition monitoring. APPLIED MATERIALS Reflexion also has built-in safety measures to ensure safe control of the grinding and polishing operations. It comes with audible and visual alarms that can be attached to any process stage, to signal a worker if a defect is detected or an incorrect process setting is selected. It also has software enabled process safeguards that can detect any unexpected changes in process parameters and abort the process if any such changes are detected. Finally, the asset is able to successfully switch between different Grinding/Polishing processes with minimal user intervention. In sum, Reflexion is a highly advanced wafer grinding and polishing model, combining state-of-the-art robotics, precision controllers, and a range of fixtures and safety measures to provide efficient control of the entire process. This ensures that consistently high-quality results are achieved even in the most demanding production environments.
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