Used AMAT / APPLIED MATERIALS Reflexion #9390825 for sale

AMAT / APPLIED MATERIALS Reflexion is a wafer grinding, lapping, and polishing equipment designed for a variety of semiconductor wafer processing applications. It is primarily used for backside grinding and lapping of semiconductor wafers including Si, GaAs, or Ge. The system consists of a modular platform which couples the grinding head, lapping plate, wafer chuck and wafer carrier. AMAT Reflexion unit allows for maximum flexibility for all manufacturing steps for the development of leading-edge devices. The grinding head of APPLIED MATERIALS Reflexion is designed for machining large and small wafer sizes with an impressive average removal rate. The rotary grinding head is enclosed in an airtight compartment, making it suitable for a wide range of cleanroom operations. Its agitator-style design ensures that all abrasive slurry is filtered out during the grinding process, which ensures higher quality results. The grinding head can be configured with either one or two grinding stones, which can be indexed depending upon the application. The lapping plate of Reflexion is designed to provide the optimal surface finish. It utilizes a high precision axis motion mechanism that is capable of active drum movement, allowing for sub-millimeter accuracy in wafer positioning and topography measurements. The plate is constructed from high-strength stainless steel and is available in a variety of sizes. Additionally, the lapping plate is adjustable in order to accommodate a wide range of diameters and thicknesses. The wafer chuck and wafer carrier for AMAT / APPLIED MATERIALS Reflexion machine are designed to quickly and precisely hold and guide the wafer during the grinding and lapping process. The carrier is used to secure the wafer to the grinding head, while the chuck is utilized for lapping. Both components are attached to the grinding head, allowing for easy and precise positioning. The chuck and carrier can be controlled through the user interface, with a single knob for adjusting the pressure and speed of the grinding or lapping process. AMAT Reflexion is equipped with a wide array of safety and monitoring devices. These include a powered interlock that stops the machine in the event of an unsafe condition, as well as an optical camera that can be used to monitor wafer thickness and condition. Additionally, the tool features a number of diagnostic features, such as diagnostics to detect and alert the operator to improper grinding or lapping speeds. Furthermore, onboard diagnostics enable users to quickly and accurately recalibrate the asset in order to achieve the desired results. APPLIED MATERIALS Reflexion is a state-of-the-art wafer grinding, lapping, and polishing model that offers maximum flexibility and precision for device processing. Its powerful grinding head and precise lapping plate enable operators to obtain the highest quality results from any wafer processing application. Its state-of-the-art safety, monitoring, and diagnostics features ensure that all operations are performed safely and effectively.