Used AMAT / APPLIED MATERIALS Reflexion #9394792 for sale

AMAT / APPLIED MATERIALS Reflexion series of wafer grinding, lapping & polishing systems was designed to enable fast, high-precision grinding, lapping and polishing of semiconductor wafers, crystals, and other substrates. In use, the equipment is capable of delivering uniformity to better than +/- 1/10th of one micron. This system is ideally suited for substrates such as Si, Ge, fused silica, quartz, GaAs, InP, and many other semiconductor materials. AMAT Reflexion unit is designed with a two-stage process, which begins with a grinding stage and then a lap and polish stage. The first stage uses a diamond grinding wheel mounted on a high-speed spindle. The diamond wheel rotates at speeds up to 5,000 rotations per minute, reducing the initial thickness of the substrate, and grinding the substrate to the desired shape and size. The second stage includes a lapping and polishing stage where the substrate is further reduced by a diamond lapping disk that is capable of working at up to 150,000 rpm. The lapping disk is capable of delivering an exceptionally high surface finish of 1 nm RMS or better. The final polishing stage is performed using micro pads and slurry, which polishes the surface to perfection. APPLIED MATERIALS Reflexion can also be configured with two lapping disks, which increases throughput and accuracy. Reflexion also includes several other features that make it easy to use and maintain. It is equipped with a robust control machine, which ensures that all components are correctly aligned and that the tool is delivering optimal performance. The asset is also equipped with a built-in safety model, which includes an emergency power button. Finally, AMAT / APPLIED MATERIALS Reflexion includes a built in vibration dampening equipment, which ensures that the entire system is isolated from environmental vibration. AMAT Reflexion wafer grinding, lapping and polishing unit offers a reliable, high-precision platform for substrate grinding, lap and polishing. Featuring a two-stage process, high-speed diamond grinding wheel and lapping disk, and built-in safety and vibration dampening systems, this machine is capable of delivering uniformity and high surface finish.