Used AMAT / APPLIED MATERIALS Reflexion #9394793 for sale

AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping & Polishing (WG-LPP) equipment is an automated platform for precise surface modification of thin films and semiconductor materials. This intuitive, operator-less system utilizes precise motion control technology to rapidly lapping and polishing deposition substrates prior to final coating deposition. The unit features an innovative robotic arm that enables precise motions for abrasive grinding and polishing of wafer substrates. The robotic arm is designed for automated adjustment and precise rotation to allow precise finishing of thin films. This precise control ensures high-yield results with consistent results that meet or exceed customer requirements. The robotic arm is adept at realizing the exact force and speed requirements for each job, allowing for uniform finishing of multiple substrates in a single pass. AMAT Reflexion WG-LPP machine also offers variable speed controls in order to achieve the precise polishing rates and levels of surface finish that are specified by the customer. This variable speed feature makes it possible to lapping and polishing a range of thin films and semiconductor material types to ensure the highest possible quality of finish. It also helps to reduce the risk of any surface damage due to over-processing. APPLIED MATERIALS Reflexion WG-LPP tool is suitable for a wide range of applications including wafer thinning, electron beam patterning, and chemical mechanical planarization (CMP) of manual or automated thin film deposition processes. The asset is compatible with a range of chemicals and abrasives, including diamond suspensions, oxide-base slurries and colloidal silica suspensibility. The model is recognized for its excellent finishing, repeatability and long-term durability. It can also be adapted for a variety of production-level jobs, including pre-polishing and post-polishing, thin film finishing, and mirror polishing. Thanks to its robust and easy-to-use design, the equipment is suitable for a wide array of materials and polishing configurations. Furthermore, the system is backed by a comprehensive service package offering technical troubleshooting and maintenance assistance.