Used AMAT / APPLIED MATERIALS Reflexion #9394795 for sale

AMAT / APPLIED MATERIALS Reflexion
ID: 9394795
Wafer Size: 12"
Vintage: 2005
CMP System, 12" FA 2005 vintage.
AMAT / APPLIED MATERIALS Reflexion Wafer Grinding, Lapping, and Polishing Equipment is a groundbreaking technological breakthrough in semiconductor wafer fabrication. The system allows operators to rapidly and accurately grind and polish wafers to feature sizes of 0.25 micron or finer. It is based upon the principle of finishing a layer of an individual material by grinding it to the desired level of smoothness using an abrasive material. The unit not only offers control of grinding and polishing times and pressure, but also enables smooth, accurate results without the need for complex tooling or templates. The result is faster, more accurate process yields. AMAT Reflexion machine uses its own patented Adaptive Layer Processing (ALP) technology to accurately control the grinding, lapping and polishing of the wafer. It uses a 3-axis robot arm with a high-precision multi-cam servo motor to align the abrasive pads and tool-plate. This ensures accurate tool alignment and smooth operation throughout the process. The tool is equipped with the highest quality diamond abrasive pads and both open and vacuum-sealed tools. This ensures the highest levels of accuracy and control. The robot arm is also equipped with a laser edge detector to ensure that the wafer is accurately shaped prior to grinding. This helps ensure that the wafer is properly shaped, which is important for obtaining consistent and accurate results. APPLIED MATERIALS Reflexion asset also includes an automated isolation model which enables isolation and removal of any particles, dust or debris that might be present on the wafer while the grinding process is taking place. This isolation equipment helps to reduce the amount of contamination caused by the grinding and polishing process. Overall, Reflexion Wafer Grinding, Lapping, and Polishing System is an essential tool for accurately and efficiently grinding and polishing wafers to feature sizes of 0.25 micron or smaller. It offers advanced control capabilities, incredibly fast and accurate operation, and a high-quality, particle-free environment. This unit stands out in the industry for its innovative design, cutting-edge technology, and unparalleled accuracy.
There are no reviews yet