Used AMAT / APPLIED MATERIALS Reflexion #9399236 for sale

AMAT / APPLIED MATERIALS Reflexion wafer grinding, lapping & polishing equipment leverages automated lapping and polishing technologies to deliver precision grinding and finishing of semiconductor substrates and other devices. AMAT Reflexion system integrates a platform design optimized with advanced lapping/polishing technologies and a flexible, personal computer-based JAVA software control package. Features such as automatic polishing security, process feedback, and array level process control enable APPLIED MATERIALS Reflexion unit to deliver maximum yields and high throughput. The unique platform includes processes for grinding, lapping, and polishing with the flexibility to configure for different substrate types such as silicon wafer and various other materials. Reflexion machine includes a specially designed environmental enclosure that provides excellent component protection and consistent particle measurements. Every component in the tool is well-known as reliable, to ensure repeatability and uniform grinding between jobs. AMAT / APPLIED MATERIALS Reflexion asset utilizes a central-lift platform designed to load the substrates automatically and securely. This reduces manual handling and prevent operator errors. It also has excellent accessibility to the substrates, including a non-contact vision-alignment camera that can acquire wafer patterns quickly. The automated mechanisms are designed to deliver repeatable results with minimal need for manual adjustments. The result is a consistent interchangeability between loads, and the ability to run a high throughput of lapping operations. Some of the process control features found in AMAT Reflexion model are its load-to-load repeatability, a control-feature programmable array, temperature & humidity monitoring, and interface to metrology & fault diagnostics systems. APPLIED MATERIALS Reflexion equipment is designed to provide superior grinding, lapping, and polishing performance across a wide range of substrates. It provides a consistent, repeatable finish for semiconductor wafers and other devices, making it possible to grind, lap, and polish with accuracy and precision. This system is an excellent choice for companies looking for an efficient and reliable wafer processing unit.