Used AMAT / APPLIED MATERIALS Titan I Heads for Mirra Mesa #293655414 for sale

AMAT Titan I Heads are an advanced wafer grinding, lapping & polishing equipment designed for the Mirra Mesa manufacturing facility. The system features several unique features that make it a reliable and durable tool for precision wafer processing operations. It is composed of a high-speed, high-precision rotating head capable of grinding, lapping and polishing both single-sided and cross-sectional wafers, and comes with a variety of tooling options for various wafer sizes and materials. The Titan I Heads feature a 3-Axis Table, stepper-motor driven motion unit which enables precise, rapid alignment of the wafer with the rotating head. This allows for grinding, lapping and polishing of wafers to dimensions as low as 5-microns. This machine is also designed to reduce quality control costs due to its highly advanced control and diagnostics capabilities; the tool communicates real-time information on grinding speed, current, and temperature, enabling operators to quickly make adjustments and corrections. The Titan I Heads have a range of features that are designed to further improve the precision of processed wafers, including a multi-zone control which determines the exact amount of material to be processed at any given time and a patented "hub control" which controls the exact pressure necessary to produce uniform grind profiles and smooth surfaces. Additionally, the asset has a dust collection facility and can be easily integrated with a chip collection model to further improve process efficiency. To ensure consistent and reliable performance, the Titan I Heads also include a built-in Automated Process Control Equipment, which makes use of several advanced algorithms to determine the correct parameters for each task. This system constantly monitors and adjusts the process to guarantee the highest quality results. In short, APPLIED MATERIALS Titan I Heads are a reliable and efficient unit for precision wafer processing operations which comes with many advanced features to ensure consistent high quality results. It is designed for easy integration with various wafer collection and dust collection systems and is capable of achieving very fine tolerances and flawless surfaces.