Used APEX SSP-50GPAW #9258844 for sale

APEX SSP-50GPAW Wafer Grinding, Lapping & Polishing Equipment is an ideal solution for the highest quality, single-step processing of substrates with thicknesses ranging from 0.05mm to 8mm. It is designed for the precision grinding, lapping and polishing of thin wafers, metals, quartz, ceramics, and other advanced materials. The system is equipped with both grinding and polishing capabilities. It has three interchangeable grinding stages (dish, flat and wafers) as well as high-pressure lapping to finish each process. The grinding stages are suitable for a variety of materials, including hardened metals and semi-rigid flex circuits. The lapping processes are highly effective for polishing a variety of materials, including ultra-thin metals, quartz, and ceramics. In addition to its speed and accuracy, SSP-50GPAW unit offers a number of other benefits. The most notable of these is its ability to reduce grinding particle size down to 0.1 micron or less. This level of precision allows for the most accurate lapping and polishing results. Furthermore, the machine includes an advanced control tool to ensure precise accuracy. This asset helps maintain lapping pressure and contact uniformity, resulting in a consistent finish that is smooth to the touch. Another benefit of APEX SSP-50GPAW model is its flexibility. It is capable of working in various configuration modes, meaning it can be configured for various wafer sizes, substrates and materials. Additionally, its compact design makes it easy to install and operate in a standard manufacturing environment. The equipment also includes various safety features and an ergonomic design. The safety features are designed to protect operators and equipment from potential contamination and damages due to mishaps. The ergonomic design makes the system comfortable and easy to use. Overall, SSP-50GPAW Wafer Grinding, Lapping & Polishing Unit is a powerful and reliable machine that is suitable for any application involving precision grinding, lapping, and polishing operations. It is a great choice for industries involved in producing semiconductors, optoelectronics, microelectronics and other advanced materials.