Used APEX SSP-900DPAW #9258857 for sale

APEX SSP-900DPAW is a powerful wafer grinding, lapping, and polishing equipment from the innovative APEX family of equipment. With its mix of advanced features and user-friendly controls for precision and reliability, grinding, lapping, and polishing of wafers and planar parts at a fraction of the time is now possible with unparalleled speed and accuracy. At the core of SSP-900DPAW is its high-end processing table. It features dual direct-drive processing heads that move independently, free of backlash and integrated with a digital encoder for precise positioning. The drive mechanism offers exceptional precision and power, allowing it to grind, lap, and polish larger wafers in less time than before. The table also boasts an adjustable working area, allowing it to process a variety of wafers and planar elements up to 9.1 x 9.1 inch, with a maximum thickness of 5 mm. Besides powerful drive and positioning capabilities, APEX SSP-900DPAW has a reliable liquid process control system. It enables the user to accurately measure flow rates and adjust them in real-time, resulting in accurate material removal and even surface finishing. Moreover, a vacuum-controlled safety unit and detachable extraction hood improve safety and smoothness of operation, guaranteeing clean work environment. To maximize performance, SSP-900DPAW includes loads of add-on options and accessories. The fully automated wafer load/unload station enables the efficient transfer of parts between the machine and another unit. It also features cleaning, edge exclusion, and dicing attachments, which can help eliminate contamination, achieve higher yields and decrease downtime. The machine is also configurable with a software package, designed to program and control all aspects of the process. All in all, APEX SSP-900DPAW is an advanced wafer grinding, lapping, and polishing tool that offers unprecedented levels of accuracy, speed, and flexibility. With its range of innovative features, it's designed to simplify the production of a wide range of wafers and planar parts.