Used APEX SSP-900GPAW #9258842 for sale

APEX SSP-900GPAW is a wafer grinding, lapping and polishing equipment designed to produce remarkably high-precision surface finishes on semiconductor wafers. This system can accurately process even the most difficult materials. SSP-900GPAW uses an advanced modular structure that maximizes the utility and accuracy of the wafer grinding operation. Its unique grinding technology allows the unit to completely remove the surface layer of the wafer, creating a highly smooth surface finish. APEX SSP-900GPAW machine is powered by an integrated grinding spindle and linear bearing tool. This combination allows for the highly precise grinding of materials and creates perfectly flat surface layers. The spindle is also adjustable in speed and depth, allowing for precise control of the wafer surface finish. To ensure maximum process accuracy, SSP-900GPAW asset also has a number of other features. Its integrated automatic wafer alignment model ensures a smooth transition between the grinding and lapping stages of the process. The equipment is also equipped with a high - speed controller and a multi-axis air bearing for smooth, precise motion. APEX SSP-900GPAW wafer grinding, lapping and polishing system provides a highly automated and precise solution for the precise polishing and grinding of wafers. It has been designed to produce the highest possible quality surface finishes and is well-suited for use in the semiconductor industry. The unit is easy to use and offers unmatched precision and accuracy. The integrated linear bearing and spindle machine provide a smooth and uniform surface finish, while the adjustable depth and speed settings allow for excellent control over the grinding and polishing process.