Used APEX SSP-900GPAW #9258845 for sale

APEX SSP-900GPAW is a multi-functional wafer grinding, lapping and polishing equipment that provides reliable, precise, and cost-effective solutions for highly sophisticated applications. Specifically, it is designed to grind, lap, and polish semiconductor wafers from 1" to 6" diameter in a single pass operation. The machine offers an adjustable grinding force, allowing it to cater to various wafer thicknesses and materials. Additionally, the variable speed grinding platform allows for higher accuracy when lapping and polishing wafers. The system uses an advanced integrated interferometer to ensure precise grinding results, with a superior control over every step. It features several innovative components, including computer-controlled grinding and lapping heads, multiple precision thickness gauges, and brushless motors. This allows for greater flexibility and control, enabling quick and accurate processing times. Additionally, the unit includes a polygonal platen, with independent positioning adjustment for maximum accuracy. Intuitive software can be utilized to program and monitor the machine operation, while a user-friendly operator console provides a modern scada solution. SSP-900GPAW offers superior safety features to ensure worker and equipment safety. This includes a powerful environmental enclosure with sensor monitors and dust collection systems. The machine also offers the ability to set user-defined limits and alarms for hazardous environmental conditions. Overall, APEX SSP-900GPAW is a versatile and reliable wafer grinding, lapping and polishing tool that offers precision and accuracy in processing wafers of various sizes and materials. It features advanced components and software for optimal control and safety, and is able to provide cost-effective solutions for highly sophisticated applications.