Used APPLIED MATERIALS Mirra Mesa #151915 for sale

APPLIED MATERIALS Mirra Mesa is a state-of-the-art wafer grinding, lapping and polishing equipment. The user-friendly design is fully automated for high-speed, high-yield production. The integral components of the system are designed to provide maximum efficiency with minimum maintenance. Mirra Mesa is comprised of a robotic wafer-handling station, a wafer grinding station, a wafer lapping station, and a wafer polishing station. The robot quickly loads, unloads, and transfers wafers between the grinding/lapping/polishing stations. The grinding station utilizes diamond grinding wheels mounted on an enclosed, precision-controlled spindle to shape the wafer. The lapping station is equipped with a multi-axial gantry for precise surface grind finish. The polishing station provides finishing and surface roughness control with a three-axis precision drive. The entire unit is designed for a wide range of wafer materials including silicon, silicon-on-insulator, and other materials. The integrated control machine features high-speed data acquisition and control, allowing for easy programming and data storage. Furthermore, APPLIED MATERIALS Mirra Mesa is extremely accurate, with tool centers in all three axes of motion, as well as excellent non-contact bearing technology for zero backlash in all three axes. The tool offers superior air filtration, with all grinding, lapping, and polishing particulates exhausted away from the work area, ensuring operator and equipment safety. Automation of the process, user-friendly programming and increased safety allows the operator to become more efficient and increases yield. Mirra Mesa asset is also expandable, with two- and three-axis configurations available. The model is capable of accurately grinding, lapping, and polishing a wide variety of wafer materials, in less time and with better yields than traditional methods. APPLIED MATERIALS Mirra Mesa is a state-of-the-art equipment designed to reduce the cost and complexity of wafer grinding, lapping, and polishing.