Used APPLIED MATERIALS Mirra Mesa #73051 for sale
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ID: 73051
metal layer CMP system, copper, 8"
Software license, re-installation and startup to Tier II
Mirra Mesa CMP
Original W system - running Cu
Mesa cleaner
One monitor, trackball
50 ft cables
InSitu removal rate monitor (ISRM) detectors on all 3 platens
50ft ISRM cables
Standard cassette tank
Titan 2 heads for tungsten
AEP retaining ring
Pad conditioner:
DDF3 - new design with clean up spray nozzle, N2 purge
Extended rinse slurry dispense arm
Platten Pad: Process kit with IC1000 pad
Standard Platten no temperature control
Wafer loss sensor with light pipe
3 slurries (AB1, AB2, AC3) 1 DIW per platten, std flow, without flow monitor
One drain line to facilities - all drains manifold into one
NPT drain fittings
Electronic control box for slurry monitoring only
Light tower: 3-color vertical, Red/Green/Yellow with flash and buzzer
No key switch, compatible with all light towers and no light tower
Lower exhaust for standalone system
Remote start/stop button on polisher
Guard ring on all EMO (CE compliant)
Single spray gun
No Window in side panel
Tie-downs on polisher & controller feet
No UPS
Smoke detector in controller
No pad puller, for one line to facilities option
Nanometrics
Universal disk holder
ABT Universal disks
Cass present sensor
Wafer mapping
Kit Cascading Ergo fabs w/o filter
2006 vintage.
APPLIED MATERIALS Mirra Mesa is the ideal wafer grinding, lapping and polishing equipment for those who need to maintain tight tolerances with excellent surface finishes. The system is designed to efficiently grind and lap wafers to a consistent, high precision finish without compromising the production process. It is powered by greater than 10kW of servo motorized spindle power, combined with advanced motion control electronics and a high performance abrasive wheel, as well as built-in calibration and process monitoring features. The unit yields a superior surface finish by utilizing a coarse grind on its various stages, but is capable of producing finer surface finishes when needed. Using a hybrid design, the grinding wheel utilizes a combination of high-performance abrasive material, diamond grit, and carbide grit to ensure that the wafer remains very smooth throughout the process. The wheel's design incorporates a wide range of spindle speeds and step advance rates to provide much faster grind and finish speeds as needed. The wheel is also equipped with a unique oscillation feature for improved accuracy and uniformity. To ensure the utmost in process control, Mirra Mesa machine includes a digital-analog-hybrid controller for precise control over the grinding and lapping process. This allows the operator to adjust the spindle speed or the oscillating speed with the click of a button. In addition, the tool monitors process temperatures, pressure, force, vibration, and other dynamics in order to make corrections as needed. In addition, the asset offers a variety of safety features such as an automated emergency shutoff and an emergency delay button in order to ensure safe operation. The model also features a zero-force compliance equipment to help protect the grinding wheel and prevent it from breaking. Finally, the system is equipped with a wide range of accessories, including various diamond and carborundum grits, wafer holders, and chucks, as well as a wide range of process monitoring and control software. All of this adds up to an efficient, controllable grinding, lapping, and polishing unit that can precisely and uniformly finish wafers with tight tolerances and a superior surface finish.
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