Used ASYST A525 #9394057 for sale

ASYST A525 is a multi-functional wafer grinding, lapping & polishing equipment powered by state-of-the-art technology and designed to provide maximum efficiency and precision for wafer and substrate production. The advanced grinding head design, coupled with the sophisticated controller and user interface, provides users the capability to grind, lap, and polish various substrates within two minutes or less depending on the application of the user's needs. The system is equipped with a high-precision four-axis robotic spindle motor for highly accurate wafer grinding, lapping, and polishing. It also features an enclosed, dust-free vacuum cooler to maintain a precise grinding environment and reduce heat build-up. All grinding, lapping, and polishing operations are controlled by the user-friendly controller and self-programming software that is capable of automatically controlling and optimizing process parameters. The controller also comes with an intuitive graphical display that allows users to quickly program and execute processes without time-consuming and tedious manual programming. In addition, A525 unit includes a variety of accessories and features designed to further enhance the grinding and polishing process. It features an automated loading mechanism for easy and precise substrate placement and manipulation during the grinding, lapping, and polishing operations. The machine also includes an automatic edge detection tool for fast recognition and measurement of substrates with curved or oblique edges. Furthermore, it features a grinding wheel conditioning asset which automatically maintains the grinding wheel's surface to ensure a consistently high-performance grinding and polishing operation. ASYST A525 model is capable of handling substrates up to 6, 8 or 12 inches in diameter and up to 0.071 inches in thickness. With a variety of accessories, such as chucks, grinding pads, holders, mounts, and more, the equipment can be configured for specific applications and requirements. It is ideal for wafer and substrate production operations, including but not limited to, thin film device production, semiconductor device processing, MEMS fabrication, and more.