Used AUGUST HEINRICH AS2 #293594840 for sale

AUGUST HEINRICH AS2 wafer grinding, lapping, and polishing equipment offers an optimal solution for on-site production of both flat and curved surface materials. This system offers a precision tool-grinding unit for producing high quality lapped and polished surfaces with superior surface finish quality on both flat and curved substrates. The machine includes advanced technology elements such as an autocleaning grinding wheel that ensures repeatability and the application of low-pressure grinding and lapping for rough grinding of small surfaces. The grinding tool boasts a high-precision machine base with rigid structure, smooth and accurate tool-path movement, maximum spindle speed of 30,000 rpm, and a closed-loop lubrication asset. In addition, AS2 is equipped with a built-in Pro-Wafer dynamic surface profilometer, which measures the surface profile of the material after each operation and delivers detailed graphs of the surface flatness and roughness. The tool is also capable of precision diamond lapping, which is essential for producing lapped substrates with better accuracy and faster cutting speed. The polishing model providing by the equipment includes a polishing machine with built-in variable-frequency eddy current drive and provides high-precision polishing of ceramic materials, glasses, and metals. The polishing machine offers a controlled polishing speed and pressure, cooling system, suaction unit, rotating and tilting capabilities, as well as an acoustic surface texture monitor and wet/dry polishing capabilities. Ultimately, AUGUST HEINRICH AS2 offers a wide range of capabilities in wafer grinding, lapping, and polishing applications. Its advanced features make it the perfect choice for working with high-precision optics and semiconductor components with an excellent surface finish. AS2 is a robust and reliable machine that is built to last, offering users high performance and great value.