Used AXUS TECHNOLOGY Capstone #293639526 for sale

AXUS TECHNOLOGY is a leader in wafer grinding, lapping and polishing for over 25 years. It is the proud owner of the Axus D-Series Process Tool Equipment, which is a complete solution for manufacturing silicon and compound semiconductor chips. This solution includes the D-Series Process Tool, D-Series Process Tool Drive Electronics, D-Series Precision Polishing Pad and D-Series Wafer Grinding and Lapping Machine. The Axus D-Series Process Tool is a high-precision mechanical and electrical system designed to provide consistent pressure and uniform grinding results across the entire wafer surface. This unit utilizes two separate modules, a Process Tool and Precision Polishing Pad, to allow controlled and automated grinding and polishing of substrates. The Process Tool employs a number of features such as active control of the grinding pressure, which help to optimize the effectiveness of the grinding process. The Precision Polishing Pad uses a micron-level control of the finish and provides uniform finish across the entire substrate surface. The D-Series Process Tool Drive Electronics provides secure and reliable control of the grinding parameters. It can accurately control the charge on the wafer surface and is capable of utilizing the parameters specified in the user's recipe. All of the parameters can be customized, providing maximum versatility to the user. The D-Series Wafer Grinding and Lapping Machine is designed to grind and polish substrates. This advanced machine is capable of processing all substrates, including, but not limited to, silicon, III-V, germanium and diamond. The machine features a large grinding wheel, a high speed spindle, a large reservoir and an adjustable wheel speed. By using these features, the user can reduce overall processing time, while improving the quality of the substrates. Last, but not least, the D-Series Precision Polishing Pad is a high-precision tool that provides uniform finishes on substrates. The pad is capable of providing very smooth finishes on metals, plastics and sapphire. The pad is also adjustable, allowing the customer to control the finish, quality, and repeatability of the substrates. AXUS TECHNOLOGY has developed a comprehensive wafer grinding, lapping and polishing machine that provides advantages for customers in semiconductor manufacturing. This tool makes use of the D-Series Process Tool, D-Series Process Tool Drive Electronics, D-Series Precision Polishing Pad and D-Series Wafer Grinding and Lapping Machine, features, and capabilities to provide reliable and repeatable results in wafer grinding and polishing. This asset is ideal for customers that need to produce high-quality substrates while reducing overall processing time.