Used AXUS TECHNOLOGY Capstone #293639527 for sale

AXUS TECHNOLOGY Capstone wafer grinding, lapping and polishing equipment is an advanced and precise wafer grinding, lapping and polishing system for production of high quality, defect-free substrates for next generation silicon devices. This unit provides the ability to improve finesse and accuracy of the substrate surfaces to a previously unattainable level. This machine is comprised of four main components: a high-performance planetary grinding head, a CNC controlled lapping table, a polisher, and advanced software for controlling both machines. The planetary grinding head is responsible for the initial machining of the wafer, including low roughness finish, high accuracy layer thickness, and defect-free surfaces. The grinding head utilizes a diamond plated grinding disc to accurately grind the wafer surface. In addition, this machine utilizes variable speed motors and adjustable pressure points to control the pressure applied to the wafer during grinding. The adjustable pressure points allow for improved grinding performance and higher accuracy levels. The CNC controlled lapping table is responsible for providing the most efficient lapping of the wafer surface. The lapping table utilizes a three-axis motion tool to accurately and rapidly lap the substrate surface. Furthermore, the lapping table also features advanced software which enables more precise, real-time monitoring and control of the lapping operation and the accuracy of the substrate surface. The polisher is used to provide a high quality, defect-free finish to the wafer surface. The polisher uses a precision machined media and a tapered, water cooled disc to ensure a uniform and consistent finish. Additionally, the polisher is driven by a servo-controlled motor for precise speed and torque control. Finally, Capstone asset also includes advanced software for controlling both the grinding head and lapping table. The software provides real-time feedback on the surface quality and performance of the substrate, along with customizable profiles for each application. This software further allows for process optimization, ensuring the highest levels of accuracy and efficiency. To summarize, AXUS TECHNOLOGY Capstone wafer grinding, lapping and polishing model is an advanced and precise equipment for production of high quality, defect-free substrates. This system is comprised of four main components: a high-performance planetary grinding head, a CNC controlled lapping table, a polisher, and advanced software for controlling both machines. Through its advanced features, Capstone unit is able to provide unprecedented levels of accuracy and efficiency for production and processing of silicon devices.