Used BAINPOL PMV009 #9309255 for sale

BAINPOL PMV009 is an automated equipment designed for wafer grinding, lapping and polishing operations. The system features a range of processing capabilities, providing a precise and repeatable method of obtaining flat and smooth surfaces with high material removal rate. The unit is composed of key components such as the wafer carriage, grinding and lapping platten and polishing stage plate. The wafer carriage allows the user to quickly and accurately load a wafer onto the machine. The carriage is based on a parallel kinematics mechanism which enables high repeatability and accuracy during the loading and unloading process. The grinding and lapping platten accommodates the wafer and carries out the wafer grinding and lapping process. The platten is adjustable and a range of grinding and lapping wheels with varying grains sizes can be used to meet the user's requirements. In addition, the platten features a dual-direction technique, with the user able to rotate the wafer in both clockwise and counter-clockwise directions to ensure even wear. The polishing stage allows for an efficient and uniform finish to be applied to the wafer surface. The polishing stage plate features a Quick Change polishing tool which allows the user to quickly and easily exchange polishing media. The polishing asset also provides automatic dosing, regardless of the type of slurry used. Additionally, the polishing stage offers the ability to control the speed, pressure and dwell time, allowing users to tailor the process to their specific needs. In addition to the hardware of the model, PMV009 offers control software that is designed to be intuitive to navigate and program. The software enables users to control all of the components of the equipment, including the wafer loading, grinding, lapping and polishing processes. Additionally, the software supports the data logging and storage of process parameters, allowing users to monitor and review process performance. BAINPOL PMV009 offers the ultimate in grinding, lapping and polishing systems with the ability to quickly and accurately achieve a high surface finish with consistent results. The system offers a highly reliable and repeatable process with fast setup times, making it an ideal choice for both research and industrial applications.