Used BBS KINMEI E 300 type II #9220661 for sale

BBS KINMEI E 300 type II is a wafer grinding, lapping and polishing (WGLP) equipment. It is specifically designed to perform precision and ultra-precision grinding, polishing and finishing of semiconductor wafers, ceramic and glass substrates. The system combines an adaptation of conventional WGLP technology with modern features to support mass production and reduce manufacturing costs. At its core, E 300 type II is designed to improve process consistency and accuracy while optimizing wafer polishing operation. It consists of a number of independently operated servomotor-driven, fixed spindles. Their robust layout and ideal alignment provide maximum flexibility and fine-tuning. Additionally, the device features a 3-axis sliding table that allows precise surface mapping for accuracy and repeatability. The electronic control unit is also designed to maximize polishing speeds, minimize polishing process defects, and ensure complete traceability. The machine's variable speed, variable speed rotary and counter rotating spindles allow for precision finishing of wafer surfaces. Also employed is a unique linear motion delivering excellent finish quality for a variety of requirements. The wafer holder has a floating design that applies equal pressure throughout the workpiece. The innovative touchless torque sensing tool applied to the polished wafer, ensures low vibration and accurate finish size. BBS KINMEI E 300 type II is capable of quick and easy set-up of recipes for future use together with the ability to connect multiple machines for simultaneous operation. What further distinct it is the convenience of being able to monitor, store and control process data from a remote interface. An on-board computer module offers a modern and intuitive 7-inch touch panel. It allows full control of process conditions, providing records of operation history for a complete overview of the production process. With its superior design and the advanced engineering knowledge, E 300 type II is an efficient choice for optimizing and improving wafer production. It effectively provides consistent wafer grinding, lapping and polishing for intricate materials, allowing customers to gain significant time efficiency and cost savings.