Used BBS KINMEI E-300 #9094693 for sale

BBS KINMEI E-300 is a wafer grinding, lapping, and polishing equipment designed specifically for optoelectronic device fabrication. This advanced system incorporates a number of industry-leading technologies to ensure accuracy and consistency of product quality. E-300 provides the capability for a variety of wafer processing operations such as lapping, grinding, and polishing. It features active dynamic segmentation grinding technology that gives users precise control over profile accuracy and process consistency. This technology allows for high resolution grinding over large areas. The single-grinding head provides noiseless operation, avoiding the need for shielding during operation. BBS KINMEI E-300 is equipped with an optimized wafer holder to ensure accuracy during grinding. It has a powerful high frequency DC motor, allowing for precise control of grinding speed. Additionally, the unit is equipped with a dual water spray machine which cools and insulates the wafer during the grinding process, ensuring safety and avoiding unnecessary damage. The full enclosure and ventilation tool, together with the built-in dust extraction asset, provide a safe work environment. E-300 is built with intuitive and user-friendly software controlling all machine processes. This model can precisely control grinding parameters such as speed, load, profile accuracy, and process time, efficiently completing the grinding tasks and ensuring top product quality. Furthermore, the software also provides remote monitoring and control capability for further efficiency. Overall, BBS KINMEI E-300 is an advanced equipment for wafer processing that is designed to yield consistent, high-grade products. It is an excellent solution for any optoelectronic device fabrication application, offering reliability, precision, and safety.