Used BBS KINMEI E-450 Prime #293661972 for sale

BBS KINMEI E-450 Prime is a powerful wafer grinding, lapping and polishing equipment designed to provide high performance grinding, lapping and polishing of semiconductor materials. Its unique and innovative design allows for unparalleled performance in terms of accuracy of grinding, lapping and polishing. E-450 Prime is a fully automated system with multiple programmable parameters for various applications. It is equipped with a maximum stage rotation speed of 10,000rpm and a linear X-Y travel of up to 60mm. The unit also boasts a wide range of grinding, lapping and polishing products that can be mounted directly onto the machine for easy use and higher throughput. The integrated vacuum wafer hold-down machine also optimizes wafer handling by ensuring a secure grip on the wafer, while minimizing the risk of wafer damage. The flexible setup parameters allow for automated compensations throughout the operation, ensuring highest precision of the grinding and polishing results with minimal effort from the operator. The tool is well suited for both short-term and long-term operation, and its modular design enables easy reconfiguration depending on the type of application. The integrated exhaust asset also ensures safe and clean operation, while the state-of-the-art, in situ process visual control model provides detailed process information which can easily be used for statistical process control. In summary, BBS KINMEI E-450 Prime is an incredibly powerful wafer grinding, lapping and polishing equipment often proveds reliable and accurate results, making it an ideal choice for a wide range of industries.