Used BEMATO PSG-614 #170095 for sale

BEMATO PSG-614 is an automated precision wafer grinding, lapping, and polishing equipment designed to pre-finish and finish-polish wafers in a variety of abrasive media. The system consists of a single-head workstation equipped with a precision robot arm and direct-drive grinding wheel. It integrates optical monitoring systems, real-time data acquisition functions, and an advanced programmable logic controller (PLC). PSG-614 is capable of programmable controlled grinding, lapping, and polishing operations with control of wheel speed, robot head position, and grinding stroke dimension. The robot arm is equipped with a high speed, direct motor drive and a three-axis positioning unit to ensure accurate grinding, lapping and polishing operations. The grinding wheel is adjustable in both speed and direction and can precisely finish wafers to strict tolerances. The machine also has an optical monitoring tool for wafer shape inspection, grinding wheel wear detection, and wafer edge detect function. This ensures that out of tolerance and damaged wafers are rejected and the grinding wheel is not worn or damaged. Data acquisition functions allow data collection from lapping and polishing operation for product quality control and process optimization. BEMATO PSG-614 is ideal for use in semiconductor, hard disk drive, and MEMS (microelectromechanical systems) industries. It is highly reliable and has an advanced interface that is user friendly and efficiently operate. Furthermore, the asset is user programmable and can easily be modified with custom software and hardware. Finally, the model components are durable, corrosion and impact-resistant, and have a long service life. This ensures the equipment's reliable performance and continued accuracy.