Used BLANCHARD 11-16 #9212503 for sale

BLANCHARD 11-16 wafer grinding, lapping and polishing system is a highly efficient machine used for the processing of wafers in the semiconductor, electronics and medical industries. The machine features a unique lapping tool, which is designed to ensure uniform wafer surface finish and consistency, while providing excellent grinding, lapping and polishing tool performance. 11-16 is designed for use with standard wet processing methods such as diamond wheel lapping and slurry polishing. The machine features a 19.5-inch grinding platen, a seven-inch disc mounted on a precision bearing system, and a diamond abrasive lapping disc. The machine can accommodate wafers up to four inches in diameter, including four-inch silicon wafers. The lapping tool is adjustable, allowing for both the precise control of abrasive processes and for a continuous variable force application during grinding and polishing. BLANCHARD 11-16 wafer grinding, lapping and polishing machine is an easy-to-operate mechanism with its own built-in digital controls. The machine also includes a servo drive for accurate speed control. It can be used with a variety of capabilities to ensure precision, such as variable speed ranges, timer functions, and automatic top-level and bottom-level functions. In addition, 11-16 includes a full scope of accessories to assist in the optimization of the grinding process. These include a stainless steel table for loading, an adjustable cover for dust prevention, a vacuum unit for dust collection, and an additional feature for edge chamfering. BLANCHARD 11-16 offers state-of-the-art process control and cleanliness capabilities, with superior surface finish profiles and a wide range of wafer sizes. Through its built-in features and multiple design capabilities, users are able to easily and quickly optimize the grinding, lapping and polishing process. As a result, it is an ideal choice for wafer fabrication facilities that require an efficient, reliable and versatile machine.