Used BLANCHARD 11-20 #9411968 for sale

BLANCHARD 11-20 Wafer Grinding, Lapping and Polishing Equipment is a precision tool for finishing hard, brittle and delicate materials. This system is capable of producing highly accurate, smoothly finished, unique surfaces with minimal polishing effort. 11-20 unit utilises a multi-stage grinding, lapping and polishing process to yield high quality, repeatable results. This process begins with grinding to reduce overall surface roughness and establish a flat, uniform, and polished surface. BLANCHARD 11-20 equipped with aluminum oxide abrasives grains are perfect for precision grinding operations and general purpose applications, including the production of high-resolution surfaces on wafer materials. The next stage of the process is the lapping. 11-20 lapping machine is designed to produce an extremely flat, smooth, and precise surface finish. Its compact size, versatility and ability to use a wide range of abrasive materials makes it suited for any precision lapping or polishing needs. The lapping tool can also be used to remove surface contaminants, improve surface flatness and reduce overall wafer thickness. The final stage of the process is the polishing. BLANCHARD 11-20 polishing asset is based on diamond impregnated polishing pads. The combination of diamond and the solid state rotating mop allows for the accurate and efficient of polishing. The diamond impregnated pads produce a high gloss, scratch free surface and the solid-state rotating mop reduces the overall cycle time. 11-20 model provides a complete solution for finishing hard, brittle, and delicate materials. The equipment is designed to provide a fast, precise and efficient grinding, lapping and polishing process that is capable of producing high quality, repeatable results. Its small size, versatile and the ability to use a wide range of abrasives makes it ideal for precision lapping and polishing operations.