Used BLANCHARD 18-36 #9053025 for sale

BLANCHARD 18-36 is a wafer grinding, lapping and polishing machine that provides superior precision and repeatability for production of ultra-thin silicon wafers. This high-performance machine can accurately grind, lap, and polish wafers up to 12" (300 mm) in diameter with repeatability of ± .5 μm. 18-36 utilizes advanced motion control technology that allows for robust process repeatability and superior spatial accuracy. Equipped with a powerful grinding spindle, BLANCHARD 18-36 offers a high-end product with advanced ergonomics and an operator-friendly operation. The adjustable grinding force allows for consistent grinding pressures over time, ensuring even wafer texture and removing tight edge specs that can be introduced by other machines. The patented auto-dressing feature reduces down time for the operator, by maximizing productivity. Its precise spindle RPM can be adjusted from 800-1600 rpm, allowing for proper material removal. The grinding process on 18-36 is done in three stages. First, the grinding spindle performs the primary material removal and creates a rough grinded surface. Secondly, the lapping plate spins and applies fine polishing to the surface, leaving a much smoother finish. Finally, the polishing is done to further refine the surface and finish. BLANCHARD 18-36 also features a high-efficiency coolant system which uses a two-stage filtration system to remove any particles that may have been introduced during the grinding process. This prevents cross contamination, reduces wear on the grinding spindle, and improves the performance of the machine. 18-36 is a top-notch machine ideal for the production of ultra-thin silicon wafers. It offers consistent accuracy, repeatability, and productivity, making it a favorite choice for manufacturers of precision electronic components.