Used BLANCHARD 18 #9238484 for sale

ID: 9238484
Rotary surface grinder.
BLANCHARD 18 is an industrial-grade wafer grinding, lapping and polishing equipment. This system is designed for efficient and precise grinding, lapping and polishing of substrates such as Silicon, GaAs, SiC and quartz. It provides a grinding surface of up to 18 inches in diameter, allowing for the processing of large-scale wafers and other substrates. The heart of BLANCHARD 18 is a rotating grinding plate that is powered by frequency control DC motors and equipped with wear-resistant diamond grinding wheels. The diamond grinding wheels have a unique and patented diamond matrix design that is custom tailored to the performance requirements of each wafer or substrate material being processed. The wheels are designed to precisely grind the material and achieve the desired shape with the desired surface finish. The unit also includes an integrated lapping and polishing module that utilizes adjustable-speed motor-driven polishing belts to achieve a uniform polishing results. The adjustable-speed polishing belts can be adjusted to match the requirements of different substrates and the desired polishing results. 18 machine also includes an automatic wafer handling module to load and unload substrates with ease. This wafer handling module can accommodate wafers with different sizes, shapes and materials, making it highly versatile. Additionally, the tool is equipped with a powerful dust collection asset to keep the work area clean and safe. Furthermore, BLANCHARD 18 model is also equipped with a host of advanced safety features to protect operators and keep your facility running in compliance with environmental regulations. This includes a safety guard with opto-mechanical interlock and emergency stop control. It also has motor overload protection and earth leakage protection. In summary, 18 is a powerful, efficient and precise wafer grinding, lapping and polishing equipment. The system is designed to handle a broad range of wafer and substrate materials and can process large-scale wafers with ease. It includes advanced safety features to protect operators and keep environments safe and compliant.
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