Used BLANCHARD 32K-60 #9364085 for sale

BLANCHARD 32K-60 wafer grinding, lapping, and polishing equipment is a fully automated, method for surface finishing of wafer-scale semiconductor materials. 32K-60 is designed to process up to 6-inch diameter wafers and is capable of both single-side and double-side lapping and polishing. The system provides both low-cycle (20 to 40 minutes) and high-cycle (up to 8 hour) processes depending on the application and substrate. BLANCHARD 32K-60 contains an automated wafer carrier with a vacuum interlock, a pre-Vacuum and a post-Vacuum lap exchange station that maintains constant vacuum between the wafer and the lap throughout the entire process. The unit also includes a precision electrical machine that provides a unique grid pattern in three axes for axial alignment of wafers at the lap exchange station. 32K-60 is designed to maintain close tolerances throughout the lapping and polishing process, with accuracy of 1um. The tool operates using a two-step process for grinding, lapping, and polishing. The first step is the lapping and grinding process, which removes surface material and provides a uniform flatness. During this step, a lap that has embedded diamond particles is brought in contact with the wafer and rotated in a controlled manner, which uniformly removes the material from the wafer surface. The second step is the polishing process, which eliminates any remaining surface material and provides a smooth and polished finish. During this step, a polishing cloth is used with a second diamond embedded lap to remove the remaining material and provide the desired finish. BLANCHARD 32K-60 is controlled by an easy-to-use GEM control interface, which allows for real-time parameter and process feedback. The asset can be programmed to run multiple wafers consecutively to maximize production and reduce cycle time.The model also features Dynamic Defect Detection, which monitors surface imperfections during the lapping and polishing process and notifies the operator of any irregularities that may need to be addressed during the process. 32K-60 provides a robust, automated platform for wafer grinding, lapping, and polishing applications for the fabrication of wafer scale semiconductor materials. The equipment provides efficient and controlled material removal, uniform flatness, and an ultra-smooth polished finish to meet the most stringent requirements. The accuracy and precision of BLANCHARD 32K-60 coupled with its ease of use make it an ideal system for the production of wafer scale semiconductor materials.