Used BLANCHARD 84 #9364336 for sale

BLANCHARD 84 is a wafer grinding, lapping and polishing equipment designed to provide high accuracy processing. The system achieves this through the use of an adjustable, stepper motor controlled head and a special, vibration-isolated table. This combination allows for precise positioning and grinding of the wafers. 84 offers a wide choice of grinding, lapping and polishing options, including various forms of grinding and lapping for processing rough, intermediate or fine finishes. Grinding is done with high-precision diamond wheels. The lapping process is carried out with batch or continuous elastomer-bonded abrasives, specifically designed to achieve the desired lapping speeds and surface qualities. For polishing, it is possible to perform single- or multi-step processes with diamond slurry- or oxide-based slurries. A finish polisher is also available for achieving the desired surface plane. The mainframe of the unit contains a robust, vibration-isolated, granite-based table. It is mounted on precision-ground stainless steel sliders and equipped with an adjustable stepper motor head, allowing for very precise positioning of the wafer holder. The machine also features an array of sensors for improved operation and wafer tracking. The drive tool for the motor head is integrated into the mainframe's frame, giving it a robust construction and allowing for high accuracy positioning. Finally, BLANCHARD 84 comes equipped with a Automatic Bias and Position Retention Asset that memorizes the grinding head position for successive wafer processing. This reduces the set-up time for each wafer, allowing for faster processing. The model also has an optional SMEMA interface for integration into automated production lines. This ensures that the grinding, lapping and polishing processes can be operated in tandem with other processes. Thus, 84 is an ideal choice for achieving high accuracy, repeatable wafer processing results. Its advanced features, precision construction and optional SMEMA interface make it a natural choice for high-precision wafer grinding, lapping and polishing applications.