Used BLANCHARD 8AD-12 #9129216 for sale

BLANCHARD 8AD-12 is a wafer grinding, lapping and polishing equipment, designed to provide efficient and reliable surface finish operations on various semiconductor materials. The system comprises of a heavy-duty, stainless steel 12" wheelhead and a high-power 12HP motor, with a welded construction for added stability. Dual-capacity quill drive and automatic wheelhead feed allow smooth and even grinding of large quantities of material for increased chip removal and improved contour consistency. The digital microprocessor-based controller offers the flexibility to select three automated grinding cycles and save time by providing repeatable results and unattended operation. The unit includes a manual variable-feed grinding wheel, diamond impregnated wheels, and an adjustable worktable. The dual-capacity quill drive provides smooth and consistent grinding wheel engagement and torque delivery to the wheelhead, while the customizable grinding speeds offer the versatility to cope with the requirements of various materials and conditions. The independent power feed table provides smooth and precise motion at a maximum speed of 200 RPM. For lapping applications, the machine features a unique, patented in-process spindle sealing tool that prevents abrasive material from entering the wheelhead enclosure. The lapping wheel options provide reliable, repeatable results and the adjustable air control allows full optimization of the diamond impregnated grinding wheels. For polishing purposes, BLANCHARD 8AD12 includes a heavy-duty vibratory wheelhead with a variable speed range from 0-800 RPM. An adjustable suspension provides both radial and vertical force control to ensure consistent, reliable results. The optional vibratory pneumatic polishing wheel enables the user to polish a variety of hard and soft materials, such as glasses and metals. Boasting numerous user-friendly features and precision engineered components, 8AD-12 is an exceptional wafer grinding, lapping and polishing asset, offering performance and power to optimize surface finish operations on semiconductor materials. The model allows superior precise control, efficient chip removal and improved contour consistency, enabling production of tight precision parts.